FIDES guide 2009

sunjianjun

FIDES guide 2009
. A" F& p# U9 [6 N$ |, O. d$ bMay 2009
Reliability Methodology for Electronic Systems
, g' r  y& g( ]/ Y+ }
Introduction
The FIDES global electronic reliability engineering methodology Guide, is composed of
- z0 ^' s8 m( U% X; Q. F( btwo parts:
2 d9 @* n9 p' [- A7 Z• a predicted reliability evaluation guide,
8 D2 s/ O9 [& }# U3 n. d' c3 ~• a reliability process control and audit guide.
1 Q* m6 z- I( {* q( H7 @The objectives of the FIDES Guide are firstly to make a realistic evaluation of the
/ {( I. O( o) }) `' B4 |reliability of electronic products, including in systems that encounter severe or nonaggressive
& W3 M) j9 M  {) H$ {0 wenvironments (storage), and secondly to provide a specific tool for the
construction and control of this reliability.
8 x& l- j9 d+ }$ ~+ YIts main characteristics are:
" t6 \' y" |! z• The existence of models both for Electrical Electronic and Electromagnetic
components, and for electronic boards or some subassemblies.
/ l/ q9 ]- v7 ]9 ?/ _0 b  T• Demonstration and taking account of all technological and physical factors that
( C' U9 G/ l8 b" M4 [have an identified role in reliability.
4 @! q3 q% a' R• Precisely taking account of the life profile.
8 Z1 `9 m8 Y3 e7 H( @1 z6 X• Taking account of electrical, mechanical and thermal overstresses.
• Taking account of failures related to the development, production, operation and
maintenance processes.
( e$ S' Q4 m- b. A7 Q• The possibility of making a distinction between several suppliers of a single
component.
The FIDES Guide can be helpful for taking action on definitions and throughout the life
- {2 L2 x( t6 jcycle of products to improve and control reliability, through the identification of
8 ?( k* m# G. `; Ctechnological, physical or process factors contributing to reliability.