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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..' J5 N+ I; q0 _( B/ ]' q
能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..
  o9 e* O% D9 v$ s* S* I' U16.4 Welding and Joining; w) Q" {; q4 l; r+ e8 e3 |* W
The bonding techniques involving adhesives are
. z3 @* u, q0 j& n- qnormally suitable for applications where the fluoropolymer1 s6 H9 \! t9 M) o
does not carry large loads such as those8 ^3 ]0 P8 M. _8 c& {
experienced by chemical processing equipment.
* t' d9 h. ?) j/ bWelding or adhesiveless joining is a method by which/ ~! c7 g! L% a/ Q' q! K6 V+ U' c0 T
parts for load-bearing applications are manufactured.
+ R) G8 C- }# Q! i6 jThe load could consist of temperature, chemical corrosion,
% }1 M( w, m" X: xand force. This method also known as welding
0 b  W9 v; X& ?' Qor joining allows economical fabrication of complex
( ]& {5 o( ]4 s+ l) Eparts by joining individual components.7 q& w" ~9 s2 w8 @
It is possible to obtain a good bond between fluoropolymers
5 j/ _  f4 L' O' g4 o( H# Jthemselves, without the use of adhesives,
) V, B9 w) `) j/ B  j/ ?1 Q9 n+ fby application of heat and pressure. Pressure can help6 k! |) U# F; J5 q# |3 w. A
drive the molten polymer into the pores of the substrate.
. P0 m5 z9 [3 Z, D5 f. X9 m; {Bond strength is dependent on the mechanical2 m, ]: z" ^; Z1 f: G& ?
interlocking that is achieved by the adhesion mechanism," t" `: S8 m8 b  G& q) }3 K0 B
improving with increased surface roughness of
7 q  d/ f; j  d. |; [  Qthe substrate. Examples of parts made by this technology
2 Z6 l4 r* v2 G+ v. ^; _- Hinclude glass cloth-backed polytetrafluoroethylene
+ Z; B5 Z, y! ~* Usheet, or multi-ply circuit board and coated6 ?8 O& K. Q3 M' e' W, }5 Z- T
aluminum or copper sheet. Achieving this type of
  Z9 t) ]: m8 bbonding is more complex with polytetrafluoroethylene
) g3 }; u% ~" vthan melt processible polymers. PTFE does not flow, l( G5 E6 n, h/ N5 y- e% w+ G2 R
after melting due to its extremely high viscosity.
& ~5 u& j4 t( R* wIt is possible to achieve adhesiveless bonding using
! Q6 @: p+ Y( G8 q# s9 v7 |standard PTFE in special applications where the; C9 D! c  n/ o
polymer can be heated to a temperature well above its' C( D$ h4 Y+ P0 s3 O7 T
melting point. It can then be forced under pressure# |% y& Q9 u! X+ k
into the substrate surface. These polymers are not
+ ^5 S! i0 N: O7 `suitable for applications where the geometry of the! E5 B4 R6 v7 U: p* K  g+ X4 X
joining objects must be preserved, contact surfaces
' j' }% W# X9 j, [; _; Z4 E: y3 hare smooth, or the objects being bonded are too large.* x( K0 ]* [- \4 i  q2 N) F% _
In such cases, a different type of polytetrafluoroethylene6 i& g0 X8 D# v7 ~
is required.
2 T$ t: ~5 y+ EPolytetrafluoroethylene for these applications is
  w5 T& `) h/ sknown as “modified” which refers to the presence of$ i# v4 g$ l0 Q9 B8 Z
a small amount of a second perfluorinated monomer,
& h) K' ~% ?- A5 {known as a modifier, in its structure. The modifier+ F$ G% p/ o5 b2 B% ^/ X3 @
molecule always contains a pendent group. The: B; @6 l8 ^+ e
preparation method of this type of PTFE has been described
% ?; |1 B9 N; R' S' nin Ch. 5. Its commercial grades have been
) o2 I" X6 O( R; e: u* Idescribed in Ch. 6.4 R  B+ B$ D( u% C: f% w3 t
How does it work? A simple explanation is offered
# `# f% X- b' ?$ W1 B, Y- Where, based on the author’s own experience. The
6 {1 r) @* I5 S. Gmodification reduces the molecular weight of the polymer,
$ a- D9 n5 ?- |. _6 L* X, v- \which in turn reduces its melt viscosity. Lower. V4 c; H3 r4 {) Z! h
melt viscosity increases the mobility of the polytetrafluoroethylene
: j7 ?3 W5 t( q; v0 Z/ @7 bchains. This facilitates diffusion and# K- N& J# ]5 e9 s- f+ \
entanglement of polymer chains at the bonding interface.4 `2 O2 u) p! d* K, V
The pendent group of the modifier disrupts the) ]3 A$ m3 ?! ~' B
crystals of PTFE, thus preventing excessive crystallization.
! Q: c2 C% Q# i, F, ZCrystallinity which is too high results in poor( l5 h. w9 K5 \& H1 S( {2 k: z4 d
mechanical properties such as poor tensile and flex5 C: U9 ^, @) d5 \
properties. An optimally modified PTFE has good$ j2 y6 \' S, M# c
mechanical properties in addition to weldability.
& R! s8 B  P) P' {& mWelding can be achieved using PTFE made by5 Y3 L% S6 n& v1 A
dispersion or suspension polymerization. Most applications
1 J$ V$ N1 |3 g; m$ `( sinvolve welding of parts made from granular) e' `* I( c( ~0 N
resins (suspension polymer). Dispersion polymerized
  d0 h8 y- q  A4 x" H0 c5 y; D* L. e0 LPTFE is also used for application such as wire
1 A/ W0 q% z: f3 s9 I% t& ycoating. A thin (50–100 μm) tape of the “modified”
0 w! U  @- d' v1 Npolytetrafluoroethylene is wrapped around the conductor
. `; h! g$ m9 W" j3 d6 z* Efollowed by sintering. The layers of the tape
0 X2 u: q3 v% {- m7 d5 _" |4 D. vadhere to each other and form a solid insulation, due: n+ _) P% v( a: z+ g
to its good interlayer adhesion, around the conductor
' k7 i& s7 G+ N. a: Z! ?- H6 Sat the completion of sintering cycle.
2 c  x0 W8 A/ O16.4.1 Welding Technique
0 ^( H* m/ m% K. P9 y% b. oQuality of a welded area is defined by the strength2 w7 z+ {# n$ r5 ~# V% h
of the bond. One of the ways to measure bond strength
' K" Z( I! `- b0 h: R7 s; cis to cut a microtensile bar specimen in such a way
" G& P, i8 C! I% [3 cthat the weld line would fall near its center (Fig. 16.5).; [/ i, `9 p* Z8 _2 ^
Tensile strength and elongation can be determined by; k) y" B/ Y# S2 u+ N; ?. Y/ i! v
extensiometry. Weld factor is defined by Eq. 16.1 as" k8 ~( a% s$ c- E& V1 ]
the ratio of tensile strength of the welded specimen
, @) r+ n' G. L6 r6 Z- D1 y! n(Tw) to the tensile strength of the material (Tp). The
  t/ x) c5 s! N3 Pweld factor is defined for the weakest polymer, if two
  o& ?* Z, K* ^3 J, E# T0 zdifferent polymers are welded together.
: ?, N/ J% b- L  KThree variables are significant in welding a given
; T1 a3 ~: b" E* j% a9 X% tmodified PTFE part: welding temperature, pressure5 z+ a% l% ]8 f% Q
and time. Optimal combinations of these three pa
0 _* z" a5 l) D3 L/ A/ o1 U# o# srameters must be found for successful welding of parts.+ G2 O2 o; e; Z( x2 M% E& `
Temperature should be well above the melting point
6 N4 I' L& M9 ^4 y0 h( g(320–330°C), typically in the range of 360–380°C.5 f$ b  c0 l7 U/ w, H$ W7 O0 c
Little pressure is required to weld the parts after reaching+ W) s. b* `/ G* c( E% e
gel state. Less than 350 kPa, and often less than
$ R" K! \- Z# L% K; Z9 J: ?9 A" s) S35 kPa, pressure is required for welding. It is normally) C7 w: u2 F0 V. \) M$ S- _
not possible to trade higher welding pressure
1 _+ S3 `8 e' E. {for lower temperature and vice versa. Time, the third
2 l+ @; ~: h  X  L* V5 g' D' Fvariable of the process, is dependent on the size and
' }8 m3 [, j5 \( u4 Bshape of the part. The actual weld time, defined as
3 W9 _+ c" x( L3 V" H8 Btime at the final temperature, is of the order of 1–2  r. Q0 K+ A4 E# U3 l# Y5 Q
minutes. It often takes a great deal longer to heat up
' d9 f( m. d2 N5 B  {! ithe part to the welding temperature. High heating rates
! u% A# M$ V$ Kdo not accelerate the process due to the low thermal
. V3 p5 B( H: q1 B! b5 kconductivity of PTFE. Heat rates similar to those of
1 y6 C4 f$ |* e* X5 z, gsintering cycles of preforms can be expected.
% F) _( b, m' b! F6 zThe mating surfaces should be smooth and uniform) K/ ~, S. ?. m( e0 t/ q) d
and free from any contamination. Unsintered
6 C! U. e- }( c% m" g* \preforms and sintered parts of modified polytetrafluoroethylene
0 ^% [5 p- M) a$ h5 Ycan be welded. Sintering and welding can
( S+ w0 R# m2 h% W- Ibe combined. Parts can often be stacked up in the5 }0 ?/ W) q- P0 ~
sintering oven without additional pressure. A weld
0 D' d% B5 i5 ~( }0 ]# Tfactor of one can be routinely obtained in the combined( H% R: I2 ^( ?- ~. ]. B
process. A higher pressure is required for welding
9 \7 l2 V! W' h5 c& xsintered parts to counteract the residual stresses,
" X% D1 G9 `9 f$ F# l5 h1 d) ?: Iwhich tend to move the parts upon release. It is important7 f4 l" f/ n8 m  x/ I* L3 R
to cool the welded parts slowly to minimize
' E! i& N, X" Q; b8 s' h! l9 {3 f* estresses stored in the part. Figure 16.6 illustrates a# J( S% ^: ~: C$ z3 I/ c3 ^3 Y1 X
device for hot-tool welding films and sheets.0 D* l! T5 ^3 O, F% V) T2 t( o
Figure 16.7 shows a comparison of the stressstrain1 D+ R- L" s: ~9 }
curves of a conventional and a modified PTFE+ {( p, ^' `- e* k
for the original and welded material. The weld line in
" S3 Y1 T* Z* T9 C! g, cconventional PTFE when welded to itself, at best, fails
& @0 l6 {1 ~) c3 }at very low strains. In the case of modified resin
8 S/ n8 u1 n; ]! ^# x; R% owelded to itself, the weld factor attains value of 0.80–6 A' ~. R4 x1 {; a. C  ]" Q
0.85. Weld factors for welding of conventional and$ S6 n, i4 \+ @+ d2 T- a6 f
modified PTFE have been reported in the range of
8 _9 Q" O/ r6 p, R0 `) A/ g% C5 N0.66–0.87.[13]$ e7 d3 D/ W; N: a- w* `2 S
Another method is welding with the help of a PFA
4 T, N& [* N7 z3 V: J(melt processable) rod. In this case, the conventional
5 `3 H- @; p" P2 Kor modified PTFE is heated by hot air near the seam
" C7 h7 t" i0 }- v0 x! X* H6 ]until it is in gel state. The PFA rod is molten and used0 E! E3 ?0 I: m
to fill the seam.
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