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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..: b( L( }; j) ?* |: {
能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..
5 d6 o7 I& h5 j! s2 p16.4 Welding and Joining+ b; b9 V7 t. w$ S( {0 p: t- s0 r
The bonding techniques involving adhesives are* i5 A/ y3 \: a) q6 d
normally suitable for applications where the fluoropolymer
: v9 b0 z. t* _# n" f( Rdoes not carry large loads such as those. }* }- N4 t7 t/ V# r' _% p
experienced by chemical processing equipment., O# Y) T3 ^7 g% A# i' k& b6 c
Welding or adhesiveless joining is a method by which
$ z' A) I& M4 q$ Aparts for load-bearing applications are manufactured.# ~$ t. M6 J, k% S& b% {) H7 k. ~+ w7 |
The load could consist of temperature, chemical corrosion,8 I& ~' G2 ?* \# D, |1 b/ H
and force. This method also known as welding
% M! f  x) Q4 dor joining allows economical fabrication of complex& A. E0 P  x  t$ ^! A
parts by joining individual components.5 G3 m9 H* A! U" v
It is possible to obtain a good bond between fluoropolymers
; c. i7 R9 C  {# t0 zthemselves, without the use of adhesives,
$ s* S0 k% h2 D: J7 U4 _9 T" vby application of heat and pressure. Pressure can help
* @1 A) v. G! m( k7 j. }drive the molten polymer into the pores of the substrate.
0 P; }6 j2 l- p: t) ^1 j$ x% F& F( TBond strength is dependent on the mechanical2 T% g- b6 L& s. M2 N1 W3 N
interlocking that is achieved by the adhesion mechanism,4 t% R6 F' u7 _2 S
improving with increased surface roughness of' `4 {9 v: d; T2 ^7 K/ g& k* q
the substrate. Examples of parts made by this technology8 e8 H- F2 i8 c1 _! c. l
include glass cloth-backed polytetrafluoroethylene% I$ V1 e2 I) u0 q/ |
sheet, or multi-ply circuit board and coated
& f6 t  E7 D3 I& |' W/ L( }- saluminum or copper sheet. Achieving this type of  o6 S& W0 Y) [- y" S& F' u
bonding is more complex with polytetrafluoroethylene# U7 n# ~( `+ O
than melt processible polymers. PTFE does not flow, ]' g0 ~1 o' r# N- [8 @: k
after melting due to its extremely high viscosity.
8 O# p  I$ n0 C9 AIt is possible to achieve adhesiveless bonding using5 H5 F! O9 y* j% n8 x
standard PTFE in special applications where the3 {; S% L& l2 ?% p3 y. p" t
polymer can be heated to a temperature well above its
( X# R% x" n/ W1 @' c5 Y8 L! Smelting point. It can then be forced under pressure
4 \8 i/ f& z& hinto the substrate surface. These polymers are not
8 w- T+ A0 l" ^# y9 Qsuitable for applications where the geometry of the9 X( ?, ^' x8 ]- A5 g7 L
joining objects must be preserved, contact surfaces: j5 J$ n# a! G' t3 v  c
are smooth, or the objects being bonded are too large.
. B1 d7 `5 V% h% I% {5 x) HIn such cases, a different type of polytetrafluoroethylene
* `2 J- R, r$ }6 X5 t2 n: iis required.. Z6 W5 x7 e4 P2 r" y: t# M
Polytetrafluoroethylene for these applications is
2 K. ^1 \: Q2 A" x( ]% pknown as “modified” which refers to the presence of
: l/ u- B4 k9 X5 Ea small amount of a second perfluorinated monomer,9 b1 `& H& A& T6 w$ ~
known as a modifier, in its structure. The modifier# c. z* E4 r3 b# {: |
molecule always contains a pendent group. The
" `# \$ Y. D6 u/ l. s, Y' h3 spreparation method of this type of PTFE has been described
) t$ [+ j  G0 D9 k. E! {in Ch. 5. Its commercial grades have been% f0 d) V/ k& E( ?0 A6 x
described in Ch. 6.
! E& Z9 @6 s6 m+ {How does it work? A simple explanation is offered
$ T3 @7 }5 a! k3 g# ^+ m- nhere, based on the author’s own experience. The6 [  d& ~+ p5 V8 h
modification reduces the molecular weight of the polymer,. t0 _: S( W) ^
which in turn reduces its melt viscosity. Lower
, _/ x. Y$ x: ?melt viscosity increases the mobility of the polytetrafluoroethylene( u  r- t! ]5 R0 T4 o; }) _
chains. This facilitates diffusion and
3 v+ y" A7 z/ `& w% G+ q9 v/ }entanglement of polymer chains at the bonding interface.
1 ]. F7 }; H0 D1 ]" fThe pendent group of the modifier disrupts the
! {# ]" c0 z: Y% @& Q1 D7 E( W( _crystals of PTFE, thus preventing excessive crystallization.
. j9 P: p4 L( l$ ]! OCrystallinity which is too high results in poor
1 y4 l( k* o7 ]. |# Rmechanical properties such as poor tensile and flex
; W! Z" e( H7 `- J* l" Tproperties. An optimally modified PTFE has good
: q7 j' S$ s9 }' Zmechanical properties in addition to weldability.3 \" p! B- ^) H/ L, Z- E8 p
Welding can be achieved using PTFE made by
7 G/ X( t' }% @: j3 @7 w) |! p- Q' udispersion or suspension polymerization. Most applications
$ r- r! t2 }- e$ X/ Qinvolve welding of parts made from granular" ^8 |0 o6 [" k: G4 l  f7 ]$ Q
resins (suspension polymer). Dispersion polymerized
2 Z/ X# f, }+ h2 k: P* GPTFE is also used for application such as wire
7 [$ R1 w, R& ^- ~coating. A thin (50–100 μm) tape of the “modified”
) y* x3 M6 x4 _# A+ r) k8 Rpolytetrafluoroethylene is wrapped around the conductor% i4 l) U: _  S7 Y$ L+ V  q
followed by sintering. The layers of the tape1 X8 e9 G% X& N% c
adhere to each other and form a solid insulation, due& y# M4 [3 Q* X, F) q9 i. O/ m$ \
to its good interlayer adhesion, around the conductor/ g( Q% H5 P6 M! Y
at the completion of sintering cycle.# W& x6 e. W- U, U7 N% r
16.4.1 Welding Technique
/ ^5 N0 i3 Q5 f: V9 w8 h* ~5 KQuality of a welded area is defined by the strength5 z# o+ W1 ~$ ~( _! H
of the bond. One of the ways to measure bond strength
, H' _) m# R- ~7 Xis to cut a microtensile bar specimen in such a way' K  w( N% `$ v! l
that the weld line would fall near its center (Fig. 16.5).1 h; T+ C" z1 [! X
Tensile strength and elongation can be determined by  D5 C% T: A- t/ a* m( S/ b
extensiometry. Weld factor is defined by Eq. 16.1 as3 R- s) Z0 v8 p
the ratio of tensile strength of the welded specimen
3 b( f1 C) L6 b(Tw) to the tensile strength of the material (Tp). The2 s% t8 ~  d9 g$ K/ f$ p  E
weld factor is defined for the weakest polymer, if two
/ ]2 {9 t8 x0 }9 Zdifferent polymers are welded together.
! y! _) |, D( @7 H0 sThree variables are significant in welding a given* R0 F' y/ n. o  b+ r3 A: e" ~: g
modified PTFE part: welding temperature, pressure; [8 M! a" p2 {9 A; Z/ f; ]
and time. Optimal combinations of these three pa5 G1 l# a& Y/ A, w8 {/ w  b
rameters must be found for successful welding of parts.) z% w7 E2 }+ ]3 }+ z
Temperature should be well above the melting point
- t' i- m1 N4 T/ j: u(320–330°C), typically in the range of 360–380°C.
. B! U$ Z0 U& g- L9 Y. kLittle pressure is required to weld the parts after reaching: D9 |2 p& {7 r0 S+ e5 z% Z3 Q, }! {
gel state. Less than 350 kPa, and often less than$ }/ S+ _1 v8 J2 A2 S7 s3 H0 D3 n
35 kPa, pressure is required for welding. It is normally
. y$ K# l+ J" a* A# y, [0 anot possible to trade higher welding pressure
& n: j6 P" ^. h5 H2 pfor lower temperature and vice versa. Time, the third/ @* N% w  R9 H: }( s
variable of the process, is dependent on the size and
: d+ \8 ^7 N2 \% ?shape of the part. The actual weld time, defined as
4 S2 o. H: T3 J) ]' `" Ftime at the final temperature, is of the order of 1–2, s+ o7 E8 V/ M! h. H
minutes. It often takes a great deal longer to heat up+ B$ H4 b. a6 d
the part to the welding temperature. High heating rates
. w) h1 l0 R% f3 V4 Y; ?' @do not accelerate the process due to the low thermal
9 m% O* f8 U# |conductivity of PTFE. Heat rates similar to those of, W! B  Y  P5 J9 I6 z. V
sintering cycles of preforms can be expected.1 @3 i3 }+ Q+ B2 c; |5 h3 o8 \# B
The mating surfaces should be smooth and uniform
1 L! h3 u0 C( i* d# I5 h/ t9 dand free from any contamination. Unsintered
% u; A4 e* J% Q, C8 v+ @preforms and sintered parts of modified polytetrafluoroethylene4 |- ~, Q; u2 a! w- Q8 q
can be welded. Sintering and welding can
2 @% I7 @1 W2 p3 Qbe combined. Parts can often be stacked up in the9 l( r% x8 \/ |2 L
sintering oven without additional pressure. A weld
$ U% z) Q, X9 v- k' Z( tfactor of one can be routinely obtained in the combined  q& ]4 [% K# h3 @
process. A higher pressure is required for welding
, Y4 k; f5 M! {8 `6 z' zsintered parts to counteract the residual stresses,4 E1 @/ R! l$ I  q9 t8 [
which tend to move the parts upon release. It is important
* t7 x( b8 P& Z5 _8 G$ R+ M* d: Cto cool the welded parts slowly to minimize5 _1 {  J" Q# T% d  ~
stresses stored in the part. Figure 16.6 illustrates a% d5 p6 X9 M# O
device for hot-tool welding films and sheets.
8 G: E: V  L& w, v9 r# dFigure 16.7 shows a comparison of the stressstrain
% P( \+ U/ W8 h: R6 y9 Rcurves of a conventional and a modified PTFE
0 G# f& m7 y; x7 q; ffor the original and welded material. The weld line in0 B2 v; w5 J2 P! |
conventional PTFE when welded to itself, at best, fails
9 @0 ^4 P6 ~# s# E, q! ~) N* mat very low strains. In the case of modified resin
2 _1 E/ E$ u- g0 N5 Jwelded to itself, the weld factor attains value of 0.80–. |( Z: N$ R5 H8 S3 H$ Q
0.85. Weld factors for welding of conventional and
* o* w4 H' q9 q: @modified PTFE have been reported in the range of
# b" r0 r! Q* a5 S  c0.66–0.87.[13]
9 G4 J+ W9 T( u3 _, sAnother method is welding with the help of a PFA
9 W+ N- P( [7 C(melt processable) rod. In this case, the conventional
+ C! H) C6 v( yor modified PTFE is heated by hot air near the seam
: s' \3 s/ b; {, {/ w; [# x, u% Ountil it is in gel state. The PFA rod is molten and used9 R. ~& v' ^4 V* P" O/ `
to fill the seam.
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