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Radiation Technology for Polymers% k' Z P Q& d" v4 c
; l X5 a6 t* o( n5 |
by Jiri G. Drobny5 Z. X$ G, U) A8 t2 \
Publisher: CRC; 1 edition (November 25, 2002) ) C* E, l4 i. G% @8 V
Language: English
& Q7 D/ a7 I. ~. v4 C3 v$ z; t) bISBN-10: 1587161087
" W. J# S' i* IISBN-13: 978-1587161087
, l2 ?, e& j/ f5 j
2 V2 U9 l0 E1 |# RBook Description
5 v/ X- y+ z& Q5 c9 N( ?6 T, G. wThe industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data.
; w) J6 Q; r- r# A( R; P" a: U1 q7 w8 F7 p- \7 R3 P
Book Info
) s( E: k. ~4 K( y; e8 |5 BCovers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.6 r( S- m1 E# t
; A% N0 }0 p/ m* x Z! Y4 O5 b
2 e1 N3 _/ v" x" j2 S, ]. F* \Contents2 Q+ V C$ C1 f% l$ R8 J
Chapter 1 Introduction
9 g# f( s# s6 O5 N$ f1.1 Basic Concepts' S" `2 s; L) d, u8 {0 x
References
0 a8 h e8 k" z0 b5 ~ OChapter 2 Producing UV and EB Energy+ O6 J& O4 Z5 E5 _: @2 W+ o
2.1 UV Energy and its Properties* l$ G* T9 j* P" b1 J& {# j& |4 S
2.1.1 Light Emission from Mercury Gas Discharge" Y( w1 b% e7 |! l9 Z8 z
2.1.2 Light Emission from a Microwave Excited Discharge
) _, V. z& O# ~2.1.3 Generation of Monochromatic UV Radiation; T( t. c1 U& D0 g
2.2 Electron Beam Energy and Its Properties, H' }. O4 ?) W+ \8 o
References0 x% @7 w6 g2 @: _1 k
Chapter 3 Ultraviolet and Electron Beam Curing Equipment
7 O. \. _$ S1 `1 ?3 b# X3 T3.1 UV Curing Equipment
" s( g. h8 n) |5 q/ H: v3.1.1 Lamps0 T5 y. a$ ]0 d$ O
3.1.1.1 Medium-Pressure Arc Lamps
) F U% @6 b5 ]7 B N" S3.1.1.2 Electrodeless Lamps6 B' F; A) p% Y' k
3.1.1.3 Low-Pressure Mercury Lamps R' @2 j- R7 c8 a
3.1.1.4 High-Pressure Mercury Lamps
( o/ q# M; V' x- P7 I3.1.1.5 Excimer Lamps
* u/ g S2 q h3.1.1.6 Xenon Lamps( l! C/ [" M" C1 N+ \) H6 T
3.1.2 Lamp Housing
# W7 z8 X& L+ |" x: u6 N! B3.1.3 Power Supply and Control Systems
1 W. i$ M- V$ U9 O3.1.3.1 Power Supply Systems
" N: F6 ]$ @' y9 S! w3.1.3.2 Control Systems$ o2 v1 |5 k% B; E; d9 j
3.2 Electron Beam Curing Equipment
2 l5 O p. Y" U. t" G. M3.2.1 Particle Accelerators. f0 Q& W9 ?9 i3 z
3.2.1.1 Direct Accelerators
* }1 u3 p; e& J3.2.1.2 Indirect Accelerators
& j# C' S4 E8 W9 u3.2.1.3 Low-Energy Electron Accelerators8 a$ ^0 P& r! x& f0 H) s
3.2.2 Recent Trends in Development of Electron Beam Curing
) O: p) g9 c: qEquipment and Technology) i& r# s4 q0 R0 `' x
References$ u: R( L$ {# Y6 N' w ]& |
5 ?" P+ l5 T+ @) P( NChapter 4 Ultraviolet Radiation Processes# G" E' K8 Z2 r2 p& Z n
4.1 Basic Concepts
+ x6 f' {: \# ?3 O* B4.2 Photoinitiators and Photosensitizers
, H5 Q# x z+ y# L1 |; W) ~4.2.1 Free Radical Photonitiators
$ M+ z# I) |# x v; k+ F4.2.1.1 Type I Photoinitiators
1 m% }' G" }. j* D& m$ `4.2.1.2 Type II Photoinitiators% ^9 w/ W" A5 C% y
4.2.2 Cationic Photoinitiators+ v, `. T; C8 s; d
4.2.3 Anionic Photoinitiators! t1 S# U F, N j7 v9 R4 C
4.2.4 Oxygen Inhibition of Cure
) ?" ?8 b: g& o: ^" n1 T% g4.2.5 Initiation of UV Hybrid Curing
9 o; |% i+ h; Z+ V R! p4.3 Kinetics of Photoinitiated Reactions4 l9 g; y/ ^1 I4 G U6 t. q( ]$ R4 M
4.3.1 Kinetics of Free Radical Photopolymerization
6 ?3 L- w J+ w4 O e4.3.2 Kinetics of Cationic Photopolymerization
! ~$ k- g, \8 U' `1 L9 _4.4 Chemical Systems in UV Processing- n# b$ r) c* S- m( ~
4.4.1 Free Radical-Initiated Systems
. f# V' G5 L% c7 o( ~4.4.1.1 Acrylate/Methacrylate Systems
* S: M; A- R) a3 S5 L3 u, V# \9 b* z4.4.1.2 Styrene/Unsaturated Polyesters
# U! k5 l1 ?: a2 O& S4.4.1.3 Vinyl Ether/Unsaturated Esters
' m# I* }% X9 E4.4.1.4 Thiol-ene Systems
1 T: r0 v1 _+ V3 p/ `4.4.1.5 Donor-Acceptor Complexes g2 `1 l$ E6 W+ M: G# Q; p
4.4.2 Cationic Systems: w6 N# Q w4 Y; W
4.5 Photocross-linking of Polymers
" P: I4 o/ {9 Y0 `% ?6 H/ ]1 W: P- EReferences
1 I+ J2 C$ H( B I( f7 NChapter 5 Electron Beam Processes
& v% S% Y' b$ B+ V \" x5.1 Radiation Cross-link Promoters, A; N( P% w& d M& M* f- m
5.1.1 Indirect Cross-link Promoters
, a! ]0 L, y5 A5 q& T+ J; \4 w W5.1.1.1 Halogenated Compounds
, P. ` t$ Z7 Y4 U5.1.1.2 Nitrous Oxide, S/ @4 F6 U- A% [/ A
5.1.1.3 Sulfur Monochloride8 K( @, y% u+ o7 o5 ]3 |
5.1.1.4 Bases5 u6 {. [5 S# V, }
5.1.2 Direct Cross-link Promoters
) V3 \% I- Q; ~, I. o' [& |7 E7 w5.1.2.1 Maleimides
0 ]* x( H) B2 t' Y1 w' m5.1.2.2 Thiols (Polymercaptans) ]' \# ^$ E% X+ O1 M J
5.1.2.3 Acrylic and Allylic Compounds.! {; j+ o! g( D! J
5.2 Retardants of Radiation Cross-Linking
. O& @- F n( j# B7 ^5 K- C3 ~( r5.3 Electron Beam Processing of Plastics2 l" m# m2 l' l1 L% S+ e, A5 {
5.3.1 Polyolefins; }3 }5 x- D/ _9 y3 P
5.3.1.1 Polyethylene2 L4 S& v2 U3 N; r( q3 Q& W
5.3.1.2 Polypropylene: B, c7 i+ `* M! N9 Q2 _
5.3.2 Polystyrene
' X, x! s* G! l- z5.3.3 Polyvinyl Chloride75
5 \0 B4 F7 k7 A/ |, R3 v, U$ }5.3.4 Polymethacrylates and Polyacrylates75% B* c* g4 I4 D2 Y/ R7 Y) z
5.3.5 Polyamides
& s) m4 j& w- H0 S B4 K5.3.6 Polyesters
- N a( L) l6 j, ?8 k5.3.7 Fluoroplastics% b9 C1 ^& X2 W4 `+ {6 d
5.3.7.1 Polytetrafluoroethylene
8 Q3 Q# r3 I* O5.3.7.2 FEP" w5 @, L4 ^, F d& k- |
5.3.7.3 Other Fluoroplastics
% Z* a6 T% x: R& G: w$ D: u3 A4 e/ w5.4 Electron Beam Processing of Elastomers) G, @/ r: H4 w$ m& v$ z
5.4.1 Physical Properties of Radiation Cross-linked Elastomers( W% d! v6 ?" o+ v
5.4.2 Effects of Radiation on Individual Elastomers
2 C9 |* |4 V6 r. |6 g: y5.4.2.1 Natural Rubber and Synthetic Polyisoprene/ u5 U! a2 Y- P8 ~2 ~
5.4.2.2 Polybutadiene and Its Copolymers# [4 i) o( y6 a6 Z2 d, N
5.4.2.3 Polyisobutylene and Its Copolymers
' Y- m' D. Y/ J* Y5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers
/ D: L5 @$ q2 X+ F5.4.2.5 Polychloroprene4 P X. l7 L6 o/ g& o+ a) A0 A
5.4.2.6 Silicone Elastomers% a9 y- [' Y, N$ R2 X+ S1 ]5 J/ w
5.4.2.7 Fluorocarbon Elastomers3 A# ?6 ^7 h3 n7 n; t
5.4.2.8 Fluorosilicone Elastomers
$ V5 a% K% t ]: X5.5 Electron Beam Processing of Liquid Systems% \# s4 j9 ?2 _: j4 e( g' {; s
5.6 Grafting and Other Polymer Modifications
' k. A* |% f, F r2 i5.6.1 Grafting
( n9 l7 V$ @! t8 k, p) @5.6.2 Other Polymer Modifications y/ E) H$ } C+ Z4 H, z1 b7 C
References
* A$ D$ o3 B/ J8 Y$ ^! zChapter 6 Coating Methods Used in UV and EB Technology. o! z& Y9 a6 c( K( x' _% H" S7 z: V
6.1 Roll Coating
& O2 B' u3 r" a5 @0 S6.1.1 Direct Roll Coating! K, G, l1 K* H, z6 ^" }$ C
6.1.2 Reverse Roll Coating2 N5 A" f% I+ `
6.2 Curtain Coating
8 m* R4 D2 }! V6 e6.3 Spray Application
* e& F% m" I- X# X, f6 n6.3.1 Compressed Air Gun Spraying# Y0 q' v w0 [* F5 O
6.3.2 Airless Gun Spraying1 o1 X4 J$ J# r( O' V# |( u+ H
6.4 Dip Coating
' ^- {5 h. O) h6.5 Flow Coating! k7 O8 T/ k! B& D) r
6.6 Spin Coating
+ D O' [! b" S! p0 A6.7 Rod Coating# e1 n2 v9 Q- a% D# }3 Z
References( ?& V3 J. |: U% d, B
Chapter 7 Applications of UV Radiation
8 N: a/ H" m; z: R" g" u7.1 UV Curing of Coatings and Paints
K6 f- p) u& v. n+ G$ N) K _9 F7.1.1 Functional and Decorative Coatings
9 M) ^2 r7 f b- F7.1.1.1 Coatings on Flat, Rigid Substrates& q/ b" { w3 ?4 C0 L" ?- R9 B
7.1.1.2 UV Curing of Coatings on Flexible Substrates
+ ^: e) J. `/ P! H* I7.1.2 UV Curing of Lacquers, Varnishes and Paints
5 k- b6 h" s2 K; H7.1.3 Three-Dimensional Curing
! Q) w+ M% C! p/ }3 _, i7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts: h: a: Q7 l: o# r7 R' v/ ?5 O
7.1.5 UV Matting of Coatings# O+ `" \3 e$ m( A }
7.2 UV Curing of Adhesives
) S2 {$ w' _2 A" ~; k7 R7 Q" w7.3 UV-Cured Silicone Release Coatings8 G* q4 w+ e! | p" s
7.4 Spot Curing8 l" G% q5 y( o5 }# m3 t
7.5 UV Curing in Printing and Graphic Arts3 _1 F8 X$ Q( K( J, G- T% X! q
7.5.1 Screen Printing
' e2 X0 _8 v6 }- t* }1 q; B7.5.2 Flexography
+ |* m: w/ P7 ~1 f% C7.5.3 Letterpress and Offset Letterpress (Dry Offset)
5 V& {& k& g$ g2 G7.5.4 Lithography7 g, _7 `- e9 s* V# ?8 y) u6 w" K! C0 Q
7.5.5 Rotogravure Printing) F* {3 o7 e- v$ E! F: G7 \- x
7.6 Rapid Prototyping
_0 l9 y" }/ Z$ Y5 i, L7.7 UV Powder Coatings
}! W% ~( c: W6 u$ @9 M7.7.1 The Chemistry of UV-Curable Powders& L: t, B) L$ j0 S, [; a
7.7.2 Material and Substrate Preparation
2 D+ |; o; y0 B% {7.7.3 Powder Coating Application
* {0 u6 n3 {0 g( T' b3 I* h7.7.4 Substrates Suitable for UV Powder Coating
g M6 w: d9 X7.7.4.1 Plastics+ o! u1 y# N0 R% Q3 g8 A
7.7.4.2 Wood and Wood Composites
" k& E: I; R2 K$ L# i8 N2 E B, x7.7.4.3 Preassembled Parts
- t+ j9 K' s* v3 W3 |/ v7.7.4.4 Large-Mass Parts
& x1 ?) [6 e* g( T7 R7.7.5 Applications' L4 w6 U# H" `- |
7.8 Other Applications for UV Curing& J# S) [% ~" Y% ~+ ]
7.8.1 Electronics
1 O: Y8 i/ A+ q* I* v3 S' R" @7.8.2 Optical Components and Optoelectronic Applications- N3 J% h6 Z0 w( N* v
7.8.2.1 Optical Fibers! {& s" E$ Y+ J7 a8 i- u
7.8.2.2 Other Optical and Optoelectronic Applications
$ _# w. `- n7 \) p5 n2 s7.9 Production of Composites
% K. Q0 S9 [0 V% x2 j0 b/ R' {/ [7.9.1 Dental Applications( x3 G" V% _& y9 z& M
7.9.2 Other Composite Applications
& {! Z, a1 f- {% eChapter 8 Applications of Electron Beam Radiation
3 `! f% ]5 O7 C6 ?1 X8.1 EB Processing in the Wire and Cable Technology
$ q5 U& T0 Q7 a8.1.1 Equipment and Process1 u2 S7 Y; s ]. }
8.1.2 Recent Developments and Trends; m4 X; o$ S c6 d2 q5 H8 z; Q
8.2 EB Processing in Tire Technology" C5 m; b5 A* v6 v: u
8.3 EB Processing in the Manufacture of Polyolefin Foams7 g1 a: y; L& A2 E
8.3.1 Foam Expansion and Its Control/ F7 H" c* r/ j4 p3 i, q
8.3.2 Manufacturing Processes6 } p) l$ A3 K; k) f1 R8 z& B
8.3.3 Comparison of Chemical and Radiation Processes
7 ^0 j+ e( u" |, i% U8.4 EB Processing in the Production of Heat-Shrinkable Materials
2 V. f2 H# _: N1 r2 ^& s# g8.4.1 Heat-Shrinkable Tubing* i/ w0 k0 f1 M/ B
8.4.2 Heat-Shrinkable Sheets and Films
6 Y d/ L7 ~. k: v+ a* X8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks: L b5 X; z5 j. Q# Q/ F
8.5.1 Magnetic Media# y* k/ U& N. i' f* E+ [8 H
8.5.2 Coatings* z1 C: V/ |. d' p# H( m
8.5.3 Printing and Graphic Arts3 T8 ^- j, a3 A6 z! |
8.5.4 Adhesives
5 M: H8 x- `" D1 M/ o4 M8.5.4.1 Pressure-Sensitive Adhesives (PSAs)
, j1 A5 Q, k4 K( v9 v% g8.5.4.2 Laminating Adhesives& z$ W, Z) c0 p" m
8.5.5 Polymeric Fiber-Reinforced Composites
0 P. L! }" F0 h) SReferences* ^# m1 L' K8 A1 ~
Chapter 9 Dosimetry and Radiometry
! |$ r, E; l9 e; B+ H$ d& ~/ D9.1 EB Dosimetry& J% M! E6 t: d0 Z& ]/ m7 l
9.2 UV Radiometry
. q ^8 T3 W9 ?7 _, o9.2.1 Actinometers
% `& S1 M, l7 X9.2.2 Radiometers
- [# K" w4 u4 ~5 K8 `3 j7 ^9.2.3 Radiachromic Films# q& X# q! p8 \" g; z
References* _* }% n) d* _% o$ D5 S
Chapter 10 Safety and Hygiene8 Z( `/ W# L: u7 X
10.1 UV Equipment Health and Safety
2 J/ S% k& W1 i8 W! @: ]10.2 EB Equipment Health and Safety* J; X6 U1 F6 }$ j S! @" T8 n
10.3 Chemical Hazards
+ ^0 q& _+ t$ q V* P: ^) U' pReferences; _$ _; H: M8 Z8 y |, r; t; ?& e% E% o
Chapter 11 Recent Developments and Trends
: @2 C7 n$ q: @# p11.1 Current Trends in Equipment and Chemistry
1 e T- p6 f+ g N, Q% m11.1.1 UV/EB Equipment
$ @4 D8 t# ]$ K8 A$ [5 X. O+ b( A11.1.2 Chemistry
# _- a. s+ C4 g# q% c11.2 Emerging Technologies
1 I# G t: q) Y' T6 IReferences* N; o& y0 }: U1 a/ q( t8 l
Appendix I
/ F$ B; G" P- g! Z0 P. z SBibliography
7 l7 C y* D* m! T8 j; s( \' B& zAppendix II: ~) y$ ?: J& y; |5 J4 Y' ?
Major Equipment Manufacturers" r, S. a5 E% z+ |5 G- o
Glossary+ c, z5 ~+ ` u$ p2 o
8 w! j7 K! ]; x) Y2 C[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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