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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..5 M  s* e+ i- S2 c. a
能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你.., H8 t1 W% W  K* R" L' U
16.4 Welding and Joining9 r; L/ ~! h' g4 d  Y
The bonding techniques involving adhesives are
7 f8 Z/ d3 |3 m4 j# j" mnormally suitable for applications where the fluoropolymer  s7 E; u0 r8 H8 r& h/ X  K) y
does not carry large loads such as those; ^- C! w& F; e
experienced by chemical processing equipment.
, `2 Z1 a+ v6 x6 h% y+ \Welding or adhesiveless joining is a method by which  Q7 |1 v) w5 l/ G% ^
parts for load-bearing applications are manufactured.: c. }( b* W; P& \1 T% k
The load could consist of temperature, chemical corrosion,/ X' z' t! M! j3 _6 e# v3 n
and force. This method also known as welding# P7 o* `0 W% G" E6 ?
or joining allows economical fabrication of complex0 L% A8 C. L! T: ?( A) B/ }
parts by joining individual components.: f7 K8 U0 y, ^# k2 Z% S
It is possible to obtain a good bond between fluoropolymers
, G5 z+ M3 C7 C6 z( Q- Hthemselves, without the use of adhesives,
3 [! |/ z9 l$ E' }' @by application of heat and pressure. Pressure can help3 f% ^0 `$ h# |/ p8 @5 I
drive the molten polymer into the pores of the substrate.
0 t+ w( ^/ e& s- z- a- Q  f, JBond strength is dependent on the mechanical
, {. B7 Q6 m3 o. \% H" Cinterlocking that is achieved by the adhesion mechanism,' t( u" A6 M0 e5 _& O3 |
improving with increased surface roughness of
: z5 O( K+ W: X+ k$ K, c; hthe substrate. Examples of parts made by this technology
% v* b# @% A( b  d- w2 r; u- Dinclude glass cloth-backed polytetrafluoroethylene* X- t' H( V+ c6 [# C3 F
sheet, or multi-ply circuit board and coated& W) Q* k1 d: _* b- H+ g* G" g
aluminum or copper sheet. Achieving this type of
# A, A+ |& f0 G1 o) m% Vbonding is more complex with polytetrafluoroethylene
, Y# q1 G' O& H, b2 f+ athan melt processible polymers. PTFE does not flow9 q: q) f% ~1 d( o
after melting due to its extremely high viscosity.2 S/ h3 B8 b! y6 l- s6 h8 P
It is possible to achieve adhesiveless bonding using
' j3 m! ]/ O, s  R% ?standard PTFE in special applications where the
) {1 A( Q0 a2 @7 ^$ l- Bpolymer can be heated to a temperature well above its4 J/ }8 a- |" j" t! R2 F) Y8 Q3 {
melting point. It can then be forced under pressure9 W6 n, `7 u3 n% L: ~
into the substrate surface. These polymers are not: `7 ]0 K' T5 H  ]
suitable for applications where the geometry of the
. b/ y3 l4 H5 A8 T" y: F* fjoining objects must be preserved, contact surfaces& a; P+ Q2 N) D4 c' o( M. q
are smooth, or the objects being bonded are too large.
! F6 x+ {2 V' d! y  O2 lIn such cases, a different type of polytetrafluoroethylene
3 K( C" L. D% O* ^& `0 wis required.% N! n' D. F: ~3 ~5 j1 X# g1 D
Polytetrafluoroethylene for these applications is+ \% {/ X. G2 `; E8 T4 P% }4 q
known as “modified” which refers to the presence of
* y3 Z- ?& N$ Q; h" y+ qa small amount of a second perfluorinated monomer,9 h+ i# q/ q% N  K
known as a modifier, in its structure. The modifier7 I  v4 t8 {0 o
molecule always contains a pendent group. The
9 e) T3 I# T  i1 K, _9 }' I, Apreparation method of this type of PTFE has been described  F5 n2 ]: |( d! A
in Ch. 5. Its commercial grades have been
& u: w, R4 }0 b2 w$ F4 Vdescribed in Ch. 6.$ x  G' [5 O1 c) }
How does it work? A simple explanation is offered
; |2 L  ~: }+ @$ j# Hhere, based on the author’s own experience. The9 i" k. j# I) g+ M4 f
modification reduces the molecular weight of the polymer,$ X! M, Q0 R- R8 @: X4 z) y  m
which in turn reduces its melt viscosity. Lower
6 i% A/ [$ G7 K  ~( jmelt viscosity increases the mobility of the polytetrafluoroethylene5 f2 \/ R0 b! V7 M5 l
chains. This facilitates diffusion and
3 Q( i- y6 D* s8 j; e7 F/ y' {entanglement of polymer chains at the bonding interface.% q) P* X4 ^: {% M: _/ L$ S* E; |
The pendent group of the modifier disrupts the/ K! C1 ~. f( ~! ^$ s. {0 h
crystals of PTFE, thus preventing excessive crystallization.2 Z" M; A' d7 V7 }$ w" |% H* @
Crystallinity which is too high results in poor
, U1 V: W2 G7 X7 ?; j  Rmechanical properties such as poor tensile and flex
/ _% f: a$ f4 f) ?& x7 ^properties. An optimally modified PTFE has good
' e6 I$ x" x- D$ Y% ]0 }mechanical properties in addition to weldability.
* Z+ {  H* K! M2 G1 Y. xWelding can be achieved using PTFE made by2 B. M" U% |6 K) L( s) O
dispersion or suspension polymerization. Most applications
) M1 @# w9 h0 r6 F' @9 D4 jinvolve welding of parts made from granular
) Y2 J6 d) F5 ?6 v+ }resins (suspension polymer). Dispersion polymerized6 f! r) R& X2 F/ x) a6 {7 ?  e: ^+ n
PTFE is also used for application such as wire
' E# K& M5 e& P3 ~! ^% q$ Ycoating. A thin (50–100 μm) tape of the “modified”/ g$ `" \8 ^) K
polytetrafluoroethylene is wrapped around the conductor
6 K  k; _- \- y! j! a4 Rfollowed by sintering. The layers of the tape
: a7 u. v4 q  o# P6 P& P4 nadhere to each other and form a solid insulation, due  k' i% g8 i2 Y# }2 A3 u# W1 f* V
to its good interlayer adhesion, around the conductor
; _: \6 u, M9 |0 q  pat the completion of sintering cycle.
: ?2 g  R2 o+ M) m  z1 u  z, D+ e16.4.1 Welding Technique" B" O0 B- s1 c* o
Quality of a welded area is defined by the strength- k- }% S" v8 ?( t1 F  x& N" ?
of the bond. One of the ways to measure bond strength# P6 s3 w5 L* R
is to cut a microtensile bar specimen in such a way2 N5 n" O, A: p; y. n$ m2 z# u
that the weld line would fall near its center (Fig. 16.5).! Y" z* \/ |6 l8 K8 Z8 I* A
Tensile strength and elongation can be determined by
7 K: G' f7 c- ^3 X: Zextensiometry. Weld factor is defined by Eq. 16.1 as  u/ V8 ]2 k* w: w( H% Q( U& H2 R! }
the ratio of tensile strength of the welded specimen! u' @7 T1 U; O- }2 s. _7 {
(Tw) to the tensile strength of the material (Tp). The9 ~5 l4 H- O+ `5 q+ p% I
weld factor is defined for the weakest polymer, if two. C. i1 y, {7 K3 K
different polymers are welded together.3 h% k& l6 `# e. `
Three variables are significant in welding a given( j9 s& z6 R! B. i; i
modified PTFE part: welding temperature, pressure( ?' ]2 H  I) v6 W  L# K0 h
and time. Optimal combinations of these three pa' [  N1 z, q6 X" n( R4 k
rameters must be found for successful welding of parts.6 ^% K- D; C: ~8 `3 e7 t" |
Temperature should be well above the melting point
8 d# a) u4 z' s) K+ A- l(320–330°C), typically in the range of 360–380°C.$ d8 M  ]# U' ]
Little pressure is required to weld the parts after reaching. M; N% y1 \8 l% z/ \1 r: t/ d
gel state. Less than 350 kPa, and often less than% ^8 M: e2 e/ m. X1 Y: V, K. B" s; Z
35 kPa, pressure is required for welding. It is normally
; C, \- o& u8 Hnot possible to trade higher welding pressure
3 m" Q4 }0 c# m( |for lower temperature and vice versa. Time, the third
6 |$ z( n, T& [& h' Nvariable of the process, is dependent on the size and8 Y5 d. m, g1 N/ q
shape of the part. The actual weld time, defined as
6 ^4 a. l( v' Xtime at the final temperature, is of the order of 1–2" k0 E; ]8 A, T$ z+ N% A2 u
minutes. It often takes a great deal longer to heat up
7 }) [- H( Z* N8 l4 w( Gthe part to the welding temperature. High heating rates
2 Z1 z# ?9 |6 ]! e: ]9 a( R- fdo not accelerate the process due to the low thermal
' E6 ^0 }( g% u/ V1 c$ M4 m7 mconductivity of PTFE. Heat rates similar to those of; O; `" p) L" l$ {0 T6 m, c' \# \' {
sintering cycles of preforms can be expected.
! p3 j4 B, `# jThe mating surfaces should be smooth and uniform
; \( T* N2 X# M; jand free from any contamination. Unsintered
, E: K& V" Q4 H4 u: B) ?preforms and sintered parts of modified polytetrafluoroethylene5 P' w0 r8 L6 F  q/ r& s5 h. t
can be welded. Sintering and welding can1 O* ?6 W2 @% i; q, g' P/ y9 h5 ]
be combined. Parts can often be stacked up in the
  c3 j2 @* u- O$ z) K4 Jsintering oven without additional pressure. A weld$ h  x& h6 i  M
factor of one can be routinely obtained in the combined9 H# D2 k4 X# M8 C8 v
process. A higher pressure is required for welding- w  \6 T& ?7 @4 \9 S4 X+ O
sintered parts to counteract the residual stresses," }2 E' _6 _" U2 R
which tend to move the parts upon release. It is important, @; X2 U  M: j+ o( z. U% {
to cool the welded parts slowly to minimize; y5 }6 a) R, ~3 F' z4 M4 y
stresses stored in the part. Figure 16.6 illustrates a
! t% l5 u1 r# ddevice for hot-tool welding films and sheets.
9 L7 s: I% [& zFigure 16.7 shows a comparison of the stressstrain! X+ ^/ _6 V" `* X, S/ u
curves of a conventional and a modified PTFE
$ M- p# [1 ~/ r6 t! K; [/ _; zfor the original and welded material. The weld line in
2 s- J% C/ u6 ?: q7 k2 n8 t+ Rconventional PTFE when welded to itself, at best, fails2 W! y0 e4 P( o- C1 b6 N) m6 D
at very low strains. In the case of modified resin
  ]& t$ w: w0 N' |) jwelded to itself, the weld factor attains value of 0.80–
" @) @: ]* l. l+ I0.85. Weld factors for welding of conventional and+ d- f! _' G! i/ A6 O; D
modified PTFE have been reported in the range of
5 `+ G5 t9 x& h% w  A7 {0 {/ `6 S0.66–0.87.[13]
/ i% K' D  \$ @Another method is welding with the help of a PFA2 L, e% Y+ b: V( n, j( @" d- E+ _
(melt processable) rod. In this case, the conventional/ l7 A6 \) q' ?' s* B5 ^4 Y
or modified PTFE is heated by hot air near the seam, o+ O& e3 Y/ s) P0 U9 @1 u
until it is in gel state. The PFA rod is molten and used. B7 }2 X: L9 h1 P
to fill the seam.
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