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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..
0 @7 ?7 X& s+ y$ m% G) W能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..& ^! G: D% P! f" c9 z# c6 C+ _
16.4 Welding and Joining4 z9 P9 c) c0 @4 M) V4 @" o, }8 J3 g
The bonding techniques involving adhesives are; r  t" S0 S2 D7 i  t# q2 |7 C
normally suitable for applications where the fluoropolymer
" b9 Z# ?7 ]9 }% I6 l3 tdoes not carry large loads such as those
7 W! t" r# y0 sexperienced by chemical processing equipment.+ T2 m/ ]! A# z: m
Welding or adhesiveless joining is a method by which
+ W9 J) V# Q9 Z3 |7 Pparts for load-bearing applications are manufactured., [. ^/ L+ `1 w- u  B! [! e
The load could consist of temperature, chemical corrosion,
0 V: E& Y6 u; _) H2 land force. This method also known as welding
0 T3 [5 R# g- H! W; N) V. H( Jor joining allows economical fabrication of complex2 T! D. _  S* }) s/ s- L
parts by joining individual components.
, r6 I7 V8 r4 G% XIt is possible to obtain a good bond between fluoropolymers
: ~8 _& O4 E0 g( I# Q. Y+ Athemselves, without the use of adhesives,* ~# S! ?. S* q
by application of heat and pressure. Pressure can help
! a: Q% ~1 c; W! _. j, jdrive the molten polymer into the pores of the substrate.
0 V$ [, y* {/ M) }& ^0 EBond strength is dependent on the mechanical
& A  {- ]+ j8 M) f4 {" R( @/ G- y" jinterlocking that is achieved by the adhesion mechanism,. V4 b% [2 {" j5 b% ]: I
improving with increased surface roughness of
9 m5 ?0 u% H8 {' K- _6 C8 U. `* ithe substrate. Examples of parts made by this technology" C4 K/ ^+ Z- g7 s# W* q  [. c
include glass cloth-backed polytetrafluoroethylene
0 p, q2 |  T- d& R7 J& bsheet, or multi-ply circuit board and coated) p2 p' w& k; ^2 f
aluminum or copper sheet. Achieving this type of$ a3 _+ Q% @2 B3 x
bonding is more complex with polytetrafluoroethylene
/ ^" j* D8 X: s6 g: t) ]+ Z0 X8 tthan melt processible polymers. PTFE does not flow
5 {1 h+ {! h' c% @! @after melting due to its extremely high viscosity.
. P& E% u6 |2 d/ E6 H9 @: X  h! tIt is possible to achieve adhesiveless bonding using9 K0 _, ^9 D% J6 z; d4 |3 d
standard PTFE in special applications where the) c. \1 p# @" x, f, V* n
polymer can be heated to a temperature well above its1 D" J: j& s$ W6 _6 R3 F. g
melting point. It can then be forced under pressure+ z; P! ~2 h  r& V# Z) F5 U
into the substrate surface. These polymers are not: J$ R( ?7 F; R8 M, p
suitable for applications where the geometry of the
6 A9 {. z+ Q% J; z0 ?joining objects must be preserved, contact surfaces
' `( N5 G) P# x8 care smooth, or the objects being bonded are too large.
, n: z! q$ y  s9 M4 T, zIn such cases, a different type of polytetrafluoroethylene( S' r  Y3 p: k7 R: ~# x3 f5 l
is required.2 S2 C' T% O& b7 a
Polytetrafluoroethylene for these applications is
( Q* z. t% [7 C/ U+ F7 kknown as “modified” which refers to the presence of8 }) d/ R6 `8 R& y% [
a small amount of a second perfluorinated monomer,
8 \& {# q2 h! i: Y6 D$ }known as a modifier, in its structure. The modifier, C7 Q8 n/ V" ~; j# W
molecule always contains a pendent group. The
3 k& U8 {0 q1 Q! v8 S9 a& u1 Ipreparation method of this type of PTFE has been described
$ a# o+ R/ p* T2 t! I, u# ^  Lin Ch. 5. Its commercial grades have been
, B# f0 B0 y# Cdescribed in Ch. 6.
; Y7 D2 y" q8 ~4 @! bHow does it work? A simple explanation is offered
" H9 E' g; m/ W" H" where, based on the author’s own experience. The2 i- l6 ?: F5 H
modification reduces the molecular weight of the polymer,
- b4 {+ Y( {9 u) d' iwhich in turn reduces its melt viscosity. Lower
+ M) \5 ]' r" W* R5 xmelt viscosity increases the mobility of the polytetrafluoroethylene- f1 ]: Z) l6 c8 b
chains. This facilitates diffusion and, K9 c- d2 O6 F
entanglement of polymer chains at the bonding interface.: o9 N2 ~3 T" g1 N1 C$ l* w3 Z' i
The pendent group of the modifier disrupts the
' R3 Q5 ]9 z$ w4 g& U1 n! Mcrystals of PTFE, thus preventing excessive crystallization.
! I6 h  Z% l1 u* {Crystallinity which is too high results in poor
2 ^: @9 p4 c' U% z; Jmechanical properties such as poor tensile and flex) }% G0 ]8 R/ m7 B1 L- U# o
properties. An optimally modified PTFE has good
7 s/ P7 w2 k, x- v7 Umechanical properties in addition to weldability.7 K5 E8 _7 W! _3 Z5 x/ a: U- P. i% k
Welding can be achieved using PTFE made by7 ^, S$ p! b7 F) H
dispersion or suspension polymerization. Most applications  O3 A7 ?7 C0 |* N
involve welding of parts made from granular
: H* F2 P3 A$ @. }resins (suspension polymer). Dispersion polymerized+ t1 v8 o+ m6 u1 \* ^( _
PTFE is also used for application such as wire
! \- e9 t% n0 W/ w3 dcoating. A thin (50–100 μm) tape of the “modified”
! v/ b3 d3 P; b' s* t) \4 d- A9 ^polytetrafluoroethylene is wrapped around the conductor9 d, n! Z" K, J. c
followed by sintering. The layers of the tape" ^+ z4 D- T5 q2 {) H" r! B
adhere to each other and form a solid insulation, due) G4 R6 l& j# l! _% n, v/ P; w
to its good interlayer adhesion, around the conductor, W6 {! S1 @5 Z, W
at the completion of sintering cycle.4 ^- S! G" I2 U8 w8 Y' G8 Y9 c9 l
16.4.1 Welding Technique
- [. l. s+ |, K  R( E9 I$ Z9 p" fQuality of a welded area is defined by the strength6 Q9 q. ?" h4 O- k3 D
of the bond. One of the ways to measure bond strength
$ T5 L1 V2 q! v& H! X' Qis to cut a microtensile bar specimen in such a way
0 e7 y4 m# n/ ~$ F# [that the weld line would fall near its center (Fig. 16.5).4 t2 A6 u$ f4 |1 j9 c2 j* _
Tensile strength and elongation can be determined by
& F& e, h' s4 H" A4 H3 V% fextensiometry. Weld factor is defined by Eq. 16.1 as& o( X5 B* p" u  {8 S
the ratio of tensile strength of the welded specimen
5 G3 D1 G2 O  T) [1 y(Tw) to the tensile strength of the material (Tp). The7 N0 ?" X$ E& a
weld factor is defined for the weakest polymer, if two
/ J& m* A. F6 J& i% x9 Tdifferent polymers are welded together.* f( n, T; T+ c" r5 ^) u* S. W5 X) E
Three variables are significant in welding a given
, U& d  ^. x: U) ~" |, d7 imodified PTFE part: welding temperature, pressure# E- \3 X% f6 \! I8 ]3 ]
and time. Optimal combinations of these three pa
3 r3 ]( |: r3 G2 S4 d4 Prameters must be found for successful welding of parts.
: e% s% m, Q# K; e% u* Q2 B  DTemperature should be well above the melting point. P5 D4 r9 j# V* d* {1 h9 m, t. |
(320–330°C), typically in the range of 360–380°C.
- f& D, ?5 S2 J' KLittle pressure is required to weld the parts after reaching
$ D6 s+ `* d, Bgel state. Less than 350 kPa, and often less than
# k$ W/ @% c% z35 kPa, pressure is required for welding. It is normally$ v# I  A2 i: [$ \' Y, f  e
not possible to trade higher welding pressure
! u. t3 Z, ]8 F: q- I; Bfor lower temperature and vice versa. Time, the third+ A5 S4 j1 ]( b6 j
variable of the process, is dependent on the size and0 T$ N) A. `- u6 K' O' d
shape of the part. The actual weld time, defined as
( E( t: L' R/ p/ O2 S" Ytime at the final temperature, is of the order of 1–2
* {, H4 ?2 o; Y" ~: ^/ gminutes. It often takes a great deal longer to heat up
* a1 P0 z( T/ r# `" rthe part to the welding temperature. High heating rates
, g6 _$ X' u: P2 h4 g8 tdo not accelerate the process due to the low thermal: o( N2 ?( l- c9 }; k8 `" N! n
conductivity of PTFE. Heat rates similar to those of
, a! A5 X7 `$ x: w: usintering cycles of preforms can be expected.
+ X9 r- \" W9 ~The mating surfaces should be smooth and uniform, D# w( k9 c; q
and free from any contamination. Unsintered
* e5 y$ T9 q. n* Dpreforms and sintered parts of modified polytetrafluoroethylene8 y8 t, B0 a- r" C) E. h
can be welded. Sintering and welding can* d9 [3 K4 i0 N1 {
be combined. Parts can often be stacked up in the# H- C# y! s  f# H
sintering oven without additional pressure. A weld3 x7 {) o) Q, z; _9 k. k6 o
factor of one can be routinely obtained in the combined
/ [6 ^" k/ {2 }9 i( R- |; n3 Sprocess. A higher pressure is required for welding0 e& C! I/ ?4 |
sintered parts to counteract the residual stresses,
' W4 n" {1 \$ Z3 [which tend to move the parts upon release. It is important# ]5 @# r& k% F% v0 g
to cool the welded parts slowly to minimize  a' `" n: R; H: I1 J" p
stresses stored in the part. Figure 16.6 illustrates a3 Y' H6 o! K) e- P7 ^' ?3 l
device for hot-tool welding films and sheets.
- F- C: E; J' x+ iFigure 16.7 shows a comparison of the stressstrain) T1 [5 l' R0 \. B) {1 h
curves of a conventional and a modified PTFE# v; s; n5 P- ]; ~
for the original and welded material. The weld line in/ L  M6 S+ C4 I  {3 r: @
conventional PTFE when welded to itself, at best, fails6 r5 W9 Y' N& o- j
at very low strains. In the case of modified resin
# T+ w# P: i4 W4 B( ^' Z0 m: |) ]5 fwelded to itself, the weld factor attains value of 0.80–
) t9 I( o/ t: x  k6 a& i( @0 ?1 B0.85. Weld factors for welding of conventional and4 K# V4 n- @" B- y9 j# P- g8 n/ D
modified PTFE have been reported in the range of) ]9 N$ H  h3 b: p2 Y' E
0.66–0.87.[13]6 g8 w: |( G9 ?
Another method is welding with the help of a PFA5 P* S; o, D  G# s" n# j" W% p; \
(melt processable) rod. In this case, the conventional, r9 d  O; g) U# p. X
or modified PTFE is heated by hot air near the seam5 j, b. t7 V7 m* K# y) N
until it is in gel state. The PFA rod is molten and used
6 J* H' E8 }& z7 t4 Dto fill the seam.
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