|
|
马上注册，结识高手，享用更多资源，轻松玩转三维网社区。
您需要 登录 才可以下载或查看，没有帐号？注册
x
FIDES guide 2009 ' }; m$ R0 t" R+ P$ h% R& i
May 2009 ) x6 x: L( k$ {6 H& E4 W' g3 o. }2 I
Reliability Methodology for Electronic Systems
7 Z, N( _$ _, J6 P+ U
# X! A3 D( v" Z! _/ LIntroduction6 K; H* p" e1 c. n4 k
The FIDES global electronic reliability engineering methodology Guide, is composed of
% A5 P: c% c$ [* k3 ^9 w" _# ~, h; Ytwo parts:9 ~: V- e% o$ h7 s$ t7 J! x1 v1 J4 n
• a predicted reliability evaluation guide,4 D3 D# J1 ]' P- z, v$ X) c0 g
• a reliability process control and audit guide.
( W- o. | N8 FThe objectives of the FIDES Guide are firstly to make a realistic evaluation of the
; f2 {7 n0 b3 S2 @& d2 preliability of electronic products, including in systems that encounter severe or nonaggressive
b$ z7 Y1 q; m( Henvironments (storage), and secondly to provide a specific tool for the
7 ?; g7 }9 E( g' m) D5 {" Rconstruction and control of this reliability.: N) \5 w1 f0 [* r2 L) G* A
Its main characteristics are:
: x) O a' R& O) h4 n1 u+ X1 r" S• The existence of models both for Electrical Electronic and Electromagnetic. I+ b" m* Y: E3 _; u0 s0 @
components, and for electronic boards or some subassemblies.
7 z0 ], i. a) D- }8 L• Demonstration and taking account of all technological and physical factors that F) u2 K4 N! B+ X
have an identified role in reliability.
) v( B& O1 ?: i. ^7 W• Precisely taking account of the life profile.
' @1 v _! ]' w2 w& H' y• Taking account of electrical, mechanical and thermal overstresses.6 ^0 O! V* P) {4 X" _1 K6 G, ~
• Taking account of failures related to the development, production, operation and
, A9 D3 w# R# zmaintenance processes.
* v3 C7 ]" a. [$ Z& k6 g) x& T• The possibility of making a distinction between several suppliers of a single
- N; m9 t. F( [component.* M( h/ V( R. g
The FIDES Guide can be helpful for taking action on definitions and throughout the life
/ e( U/ f2 g( F* b( X/ jcycle of products to improve and control reliability, through the identification of. C6 N- A0 X% x2 p6 U0 G
technological, physical or process factors contributing to reliability. |
|
发表于 2009-6-9 09:21:43
