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Radiation Technology for Polymers E& `/ n- y1 C: |( K
; g& Q Q9 U& z- n- p* Yby Jiri G. Drobny
1 G" w& z0 w/ V* `# V, jPublisher: CRC; 1 edition (November 25, 2002)
( A. {8 P/ t3 e% @Language: English 4 n* c. Y" {; t$ W8 _4 H
ISBN-10: 1587161087 Z4 G3 |7 M2 ~- N5 j% Q
ISBN-13: 978-1587161087
) v8 n' h y1 M, e! R% A
& }' j" g$ \8 M+ PBook Description7 J9 ^+ s" H1 _2 O8 h9 I4 _
The industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data. 1 O3 P9 g2 C( b) j8 w8 t, Q
( @% D" e8 K* Y+ {Book Info
3 _( N, h K3 V& |4 ]Covers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.. V6 p& k- Z" Z) p7 f R E$ D/ B
$ U9 B. D. n6 o* F, m8 W9 t
1 C: w |$ D6 G$ k& IContents
* U* ]5 A. u4 i8 G7 Y+ c; e7 BChapter 1 Introduction
5 Q/ {% T+ Y* U: T1.1 Basic Concepts, v2 i4 s b: l
References
% c' Y$ v) D3 H! tChapter 2 Producing UV and EB Energy
. O" g) ], |5 J4 T2 X+ `2.1 UV Energy and its Properties
( J+ W# ^! ], v* Q. V2.1.1 Light Emission from Mercury Gas Discharge
4 S* I) g9 `/ b8 X! s9 B% J: i2.1.2 Light Emission from a Microwave Excited Discharge5 j7 s6 I$ y# @- V
2.1.3 Generation of Monochromatic UV Radiation
- P" ~. ?7 r1 o2.2 Electron Beam Energy and Its Properties
L+ a7 R- \& e( O8 QReferences
4 u9 S! U ~- b" P, D) \$ l$ |; FChapter 3 Ultraviolet and Electron Beam Curing Equipment) J- W! |# ^6 X& V3 X& d
3.1 UV Curing Equipment. U& p/ a; r2 e* ]6 N
3.1.1 Lamps7 N% `# n/ M" D. U4 @
3.1.1.1 Medium-Pressure Arc Lamps* H2 x, b# }" M6 i5 s( F
3.1.1.2 Electrodeless Lamps
1 Z$ Z0 M& e$ T: |. N/ U" t3.1.1.3 Low-Pressure Mercury Lamps
6 Q3 } s! j& d3.1.1.4 High-Pressure Mercury Lamps0 j U1 n3 V% }+ R. \" w
3.1.1.5 Excimer Lamps
3 e R! A, Z# L- X, O5 G4 q3.1.1.6 Xenon Lamps
. e" ^2 }' E' K _# ?5 s2 U; b3.1.2 Lamp Housing/ d* l {$ u0 W* n0 {) |5 C
3.1.3 Power Supply and Control Systems1 t# |: j$ B' U$ U. i/ I) B
3.1.3.1 Power Supply Systems
$ p0 I- B+ ^& L2 a* L2 X3.1.3.2 Control Systems
' \8 s' z S% A/ c7 y, q3.2 Electron Beam Curing Equipment
: h4 n, Z4 {1 I; {3.2.1 Particle Accelerators4 i. O% E6 V1 s
3.2.1.1 Direct Accelerators! F. W2 @9 r+ _& H
3.2.1.2 Indirect Accelerators! I5 M- N# k" O3 G5 L/ R
3.2.1.3 Low-Energy Electron Accelerators, B' R4 @9 x9 W* \# v" ]- k5 ^
3.2.2 Recent Trends in Development of Electron Beam Curing5 k; T7 i* T: [/ q; q
Equipment and Technology
a2 E: V- @. X3 LReferences
1 K( V# _9 }* T4 @+ @3 i- l* }4 f! n* w/ z7 G
Chapter 4 Ultraviolet Radiation Processes+ Z* y# F) n9 J9 r' Q
4.1 Basic Concepts
* y }# `& w- ^, i5 J& q4.2 Photoinitiators and Photosensitizers2 K; S z3 `! b% w+ [: I
4.2.1 Free Radical Photonitiators# s3 {% q3 l& i, L. _& Z6 X
4.2.1.1 Type I Photoinitiators& B/ B8 {0 A- v3 P! A3 g0 P7 f
4.2.1.2 Type II Photoinitiators
! C( Z' S r$ ] q4.2.2 Cationic Photoinitiators
H3 p1 U/ Y9 R; g$ Y4.2.3 Anionic Photoinitiators
; R4 F% F/ w" o# }" M! w% a4.2.4 Oxygen Inhibition of Cure* K, R2 V5 {/ X' ?
4.2.5 Initiation of UV Hybrid Curing
. ~. f& x1 Z( L) R6 t" u4.3 Kinetics of Photoinitiated Reactions
8 A4 b3 B" h! ]. k1 C4.3.1 Kinetics of Free Radical Photopolymerization0 @' p/ l% g8 S% b3 Z
4.3.2 Kinetics of Cationic Photopolymerization
$ }( G% z5 B8 [& j4.4 Chemical Systems in UV Processing
) P0 V& c; q7 ]8 V* f) I7 P' E3 [4.4.1 Free Radical-Initiated Systems
0 X, c y6 ~7 `1 N/ U: X% ~* ^4.4.1.1 Acrylate/Methacrylate Systems
( J7 Q& @7 z% h e; D4.4.1.2 Styrene/Unsaturated Polyesters3 q# O$ ^; Y/ H
4.4.1.3 Vinyl Ether/Unsaturated Esters
6 {4 o1 W7 f3 J5 V+ `4.4.1.4 Thiol-ene Systems
5 s! _; r. l! ^/ X, h: Y) q4.4.1.5 Donor-Acceptor Complexes
) ~& Z) W4 b+ l4 a# I, {4.4.2 Cationic Systems
% ], g2 S/ b& _7 v6 u0 ^4.5 Photocross-linking of Polymers" z2 u0 H2 ?' }. i
References6 S" n6 i3 ?; d3 P* w2 v7 t
Chapter 5 Electron Beam Processes
+ ]; V% v) Z; o, O2 W# B5.1 Radiation Cross-link Promoters
) E( T" l' ]5 Q; w8 d9 i1 [5.1.1 Indirect Cross-link Promoters) H! Y6 f6 W) N' _: K! n
5.1.1.1 Halogenated Compounds
2 C( x$ _8 O! `' W5 P6 K A5 c5.1.1.2 Nitrous Oxide
3 E; S: k0 E8 T; R$ I5 _' [1 X5.1.1.3 Sulfur Monochloride* h) r" a: N6 Q
5.1.1.4 Bases
8 k- G& E( K# U3 S4 a2 l1 K5.1.2 Direct Cross-link Promoters- u! J, v8 n) p& Q
5.1.2.1 Maleimides1 p8 B2 G1 u V0 l
5.1.2.2 Thiols (Polymercaptans)
+ L, E8 p7 T7 x! y! J. ~- D5.1.2.3 Acrylic and Allylic Compounds.3 B: e( y# D. v4 e4 d3 ~2 I; E
5.2 Retardants of Radiation Cross-Linking( l+ U) R$ ?- L1 Z
5.3 Electron Beam Processing of Plastics; |% X) t8 ~/ s. o
5.3.1 Polyolefins
+ _0 q+ p% ^6 ]. s5.3.1.1 Polyethylene
- C* k. a& V6 f- @1 i/ C: w5.3.1.2 Polypropylene
8 `' o: t, G# f5.3.2 Polystyrene6 D+ l B8 }1 K: [
5.3.3 Polyvinyl Chloride753 O- Z% P# J; ]$ K2 M3 i
5.3.4 Polymethacrylates and Polyacrylates75
9 z Z* _9 p4 k4 |7 n: B; ~5.3.5 Polyamides% W9 }/ L2 a: U( d
5.3.6 Polyesters
* I+ [- K9 r/ A4 a$ p, V! M/ C# T5.3.7 Fluoroplastics* h0 p' z2 o- g. N+ P( k4 l
5.3.7.1 Polytetrafluoroethylene3 P8 x' I- v Z8 I. o4 F
5.3.7.2 FEP- R- Q# G. m, p( T: N2 h/ ^7 C! c
5.3.7.3 Other Fluoroplastics+ n: H8 y7 i: _& }' O2 h' P- Q3 N
5.4 Electron Beam Processing of Elastomers7 l) K! R. t/ g
5.4.1 Physical Properties of Radiation Cross-linked Elastomers
4 ]0 `% Z6 p4 ~# _( _5.4.2 Effects of Radiation on Individual Elastomers
' {5 e; o& c7 k& P$ d5.4.2.1 Natural Rubber and Synthetic Polyisoprene. b6 [# m% d7 o+ T
5.4.2.2 Polybutadiene and Its Copolymers0 I" ^% D- d/ H5 N. r3 z9 ]
5.4.2.3 Polyisobutylene and Its Copolymers
^" @/ f9 T0 P5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers5 u$ X" V% A) l' G7 S; \
5.4.2.5 Polychloroprene9 L7 W# K& f+ i! q. ^/ K: f- a$ v
5.4.2.6 Silicone Elastomers% y( F( }. t& p1 r+ F
5.4.2.7 Fluorocarbon Elastomers, Z' O* \4 @2 `' x
5.4.2.8 Fluorosilicone Elastomers
5 j A5 e3 _3 w3 D2 ^. M1 e5.5 Electron Beam Processing of Liquid Systems
1 g- \4 K1 W9 w5 V) L# F' Q4 [5.6 Grafting and Other Polymer Modifications( Q( q0 ^8 m( a% \5 d3 X
5.6.1 Grafting5 i6 d7 M7 k* A5 ]. y0 k$ L
5.6.2 Other Polymer Modifications
" f- G, ~5 P7 n0 ^References
3 R9 G" v3 H T" a5 c! b$ DChapter 6 Coating Methods Used in UV and EB Technology) T/ k. U3 c9 l
6.1 Roll Coating( _% Q4 |/ V2 t: z! x8 O
6.1.1 Direct Roll Coating
8 D {: h" b- p6.1.2 Reverse Roll Coating2 @) n) i6 F% M8 U
6.2 Curtain Coating
2 |) K. H7 y3 T5 V- U. v8 `. Z6.3 Spray Application# r4 u' k9 C) U* y% g/ p+ K
6.3.1 Compressed Air Gun Spraying
4 v* T6 t; ^# q/ ]6.3.2 Airless Gun Spraying
$ T& T. n D8 L" y3 ]$ O6.4 Dip Coating
' }& G* b2 t, V5 x k9 y) y S% `6.5 Flow Coating: M$ V1 Q3 f" b; m# l l1 c
6.6 Spin Coating$ O6 \* }9 ]" d- X, s
6.7 Rod Coating" w% K$ |( u0 B" f8 K \
References3 l8 O# k, W0 L/ p; p( i5 ]
Chapter 7 Applications of UV Radiation1 O, e' X# ]: P
7.1 UV Curing of Coatings and Paints+ [5 D% ?/ v8 ^- F Y
7.1.1 Functional and Decorative Coatings
: w0 H2 ^4 y/ e6 S7.1.1.1 Coatings on Flat, Rigid Substrates. N4 j2 _" P* }+ h, e1 Q
7.1.1.2 UV Curing of Coatings on Flexible Substrates4 {7 _! h3 n4 O
7.1.2 UV Curing of Lacquers, Varnishes and Paints4 p4 K7 a5 i, x0 F
7.1.3 Three-Dimensional Curing
0 F& v' N$ @( S7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts2 [& ^, P5 x( K( @/ n: h' X
7.1.5 UV Matting of Coatings
( D. [5 }2 R- v+ y) X3 B7.2 UV Curing of Adhesives
: N' c# i& \. V8 p( Q2 g! [7.3 UV-Cured Silicone Release Coatings
1 B0 e7 N) @( y( D; {7.4 Spot Curing
9 D% }% O# x- f9 W2 u. A7.5 UV Curing in Printing and Graphic Arts9 I. ?( O& k2 E' a, \
7.5.1 Screen Printing
1 y5 }* C p$ [: j% M4 P7.5.2 Flexography2 b: c5 U: `3 T/ y v
7.5.3 Letterpress and Offset Letterpress (Dry Offset)
: n8 i5 h9 `* C5 _7.5.4 Lithography
1 M9 A3 F* e4 l% T4 |( A% ^6 q7 V7.5.5 Rotogravure Printing- C* U6 f/ S* e( d
7.6 Rapid Prototyping
2 a, z+ ?2 f5 k5 L7.7 UV Powder Coatings
9 V! F/ u: h) O4 N2 v7.7.1 The Chemistry of UV-Curable Powders
3 L6 u% P, E3 x, B* u$ X- }7.7.2 Material and Substrate Preparation4 M6 L0 u) w) [8 M2 X& Z
7.7.3 Powder Coating Application
' Y9 G7 W# ?' w" }7.7.4 Substrates Suitable for UV Powder Coating% G4 I/ X- @6 J0 p# e7 E
7.7.4.1 Plastics
4 j: n+ T3 }, H, I: U1 A7.7.4.2 Wood and Wood Composites
& X h0 F3 W+ x. {7.7.4.3 Preassembled Parts
, Y1 h) E. L5 h7 N6 g7 }7.7.4.4 Large-Mass Parts
* m3 O: Z+ w4 x0 q7.7.5 Applications6 z& M0 ^1 l$ Z3 X. Q
7.8 Other Applications for UV Curing3 @3 P. A2 G! u% \5 K9 X
7.8.1 Electronics- p. Y* u' O3 {8 q% d. H3 w
7.8.2 Optical Components and Optoelectronic Applications
8 i8 z; b! F$ {. H% ]7.8.2.1 Optical Fibers
( F7 F- [9 y7 p, |) W' U7.8.2.2 Other Optical and Optoelectronic Applications
G: L% A8 y# C- Y$ _7.9 Production of Composites
0 q/ I O% u6 y; v5 s, _: X7.9.1 Dental Applications
: \9 m1 O1 ~3 m0 D2 C+ u7.9.2 Other Composite Applications6 o/ }& ]7 y% \& G, Z
Chapter 8 Applications of Electron Beam Radiation+ }7 m: v4 Y/ ]( C: b8 g
8.1 EB Processing in the Wire and Cable Technology
) O6 H! n& Q+ g7 j; ]5 h9 n8.1.1 Equipment and Process
4 e5 l, }1 s0 V9 W) v8.1.2 Recent Developments and Trends
, U% P* N: L1 q8.2 EB Processing in Tire Technology. u0 Y8 e+ K F5 b
8.3 EB Processing in the Manufacture of Polyolefin Foams
6 F6 N3 j# ]2 {/ k# o) L8.3.1 Foam Expansion and Its Control
" j4 e7 W3 c. W2 k8.3.2 Manufacturing Processes
2 h! f$ n$ {8 M% n8.3.3 Comparison of Chemical and Radiation Processes
* i& S" X1 \( F1 I6 s, t( a: Q) X8.4 EB Processing in the Production of Heat-Shrinkable Materials
0 e i6 o( ~/ Z. W, F9 C8.4.1 Heat-Shrinkable Tubing$ |$ l) g- z1 s( F9 l- }' L) H
8.4.2 Heat-Shrinkable Sheets and Films2 Y3 W6 V8 I, }/ d
8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks8 w3 u$ i- n* A; R+ u
8.5.1 Magnetic Media
" A6 \: u/ |; P6 H+ ~" c' q. T8.5.2 Coatings
$ V8 E. P& m5 Z: z8 Y: ?8.5.3 Printing and Graphic Arts4 ^4 \% u$ u& \
8.5.4 Adhesives( J+ d1 E! p9 l9 t$ p9 s% H9 f
8.5.4.1 Pressure-Sensitive Adhesives (PSAs)
" u& q2 K; a9 Q/ c9 U4 E$ B8.5.4.2 Laminating Adhesives6 F$ l& R, s" s1 A. U
8.5.5 Polymeric Fiber-Reinforced Composites$ [5 [9 O3 H! u* b) a! h
References
( a, r1 v0 S8 vChapter 9 Dosimetry and Radiometry& r5 g1 G3 i& p
9.1 EB Dosimetry( `& i2 M) o! t
9.2 UV Radiometry
8 o, h$ M" @, Q' i4 @" l9.2.1 Actinometers9 p; u# ]- [" v
9.2.2 Radiometers# Q, D: G; c1 J+ {& l- K
9.2.3 Radiachromic Films$ x+ y! e- A2 Q/ b# S9 X' S7 c
References: \: l1 ]1 q- A; _9 g! R
Chapter 10 Safety and Hygiene* Y2 m% c9 c% r% W3 P
10.1 UV Equipment Health and Safety
/ y+ S b9 X6 E8 `0 K, ~ Z. _; f10.2 EB Equipment Health and Safety6 O' ~- t: `* `
10.3 Chemical Hazards- M% n' Y3 K4 s8 p _8 r0 R
References
; T$ G9 c0 f& k* u& i/ ^6 ~Chapter 11 Recent Developments and Trends
# p. t. H9 N3 N11.1 Current Trends in Equipment and Chemistry/ X( T* J Z) @5 d( g
11.1.1 UV/EB Equipment4 L) H2 x* J0 Q* U4 u h7 U4 T
11.1.2 Chemistry$ |, l* q2 l/ k* m) R
11.2 Emerging Technologies' {5 R: F0 g8 `8 V( }
References* i, W6 Z" {: ~ k' D; M0 w9 l9 T
Appendix I
, e/ G& w6 y0 h2 `& L a7 ?) oBibliography' k( X) o% R: U+ y& E
Appendix II A1 L+ o# }0 H; o
Major Equipment Manufacturers6 C. H2 L5 ]2 p j, `! W
Glossary0 z8 w3 J1 F* P, H) D3 L
! G, ^2 t3 K6 B! [$ ?/ N& s
[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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