FIDES guide 2009

sunjianjun

FIDES guide 2009
( L" W8 M/ j* e4 ?& r8 PMay 2009
Reliability Methodology for Electronic Systems

Introduction
The FIDES global electronic reliability engineering methodology Guide, is composed of
two parts:
• a predicted reliability evaluation guide,
• a reliability process control and audit guide.
2 ^/ l3 ^+ x) N* uThe objectives of the FIDES Guide are firstly to make a realistic evaluation of the
reliability of electronic products, including in systems that encounter severe or nonaggressive
( c; E& S( ?* x/ [8 zenvironments (storage), and secondly to provide a specific tool for the
4 b& }* R* f' o- S0 z, e" bconstruction and control of this reliability.
Its main characteristics are:
' W, o' w) ?( g) F5 |$ U/ X) ]" z• The existence of models both for Electrical Electronic and Electromagnetic
1 f. L/ ]% ~$ Y7 ?7 b3 _7 o' Dcomponents, and for electronic boards or some subassemblies.
0 g3 e: R$ `. C: w• Demonstration and taking account of all technological and physical factors that
) T" f! V* Z% B0 g  ~" Yhave an identified role in reliability.
: P+ Z+ ~- G& |& z• Precisely taking account of the life profile.
: E: W! K2 ^6 Z0 r7 Q• Taking account of electrical, mechanical and thermal overstresses.
, }$ y- Q; K2 e! B4 s0 W" y• Taking account of failures related to the development, production, operation and
& v" C6 J" F0 H: i$ Vmaintenance processes.
• The possibility of making a distinction between several suppliers of a single
component.
The FIDES Guide can be helpful for taking action on definitions and throughout the life
cycle of products to improve and control reliability, through the identification of
technological, physical or process factors contributing to reliability.