《Chemical vapour deposition of coatings》英文原版

qimingstar · 发表于 2008-12-23 16:01:15

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Contents
1. Definition .....................................................................................................................60
2. Background .................................................................................................................60
2.1. Nanostructured materials .........................................................................................62
2.2. Free standing shapes ..............................................................................................62
2.3. Rapid prototyping ....................................................................................................63
3. Advantages and disadvantages of CVD.......................................................................63
4. Thin film and coating applications.................................................................................64
5. CVD system .................................................................................................................65
5.1. Chemical vapour precursor supply system ...............................................................66
5.2. CVD reactor .............................................................................................................67
5.3. The effluent gas handling system ..............................................................................67
6. Process principles and deposition mechanism...............................................................70
7. Chemical precursors and reaction chemistry.................................................................70
8. Thermodynamics, kinetics and mass transport phenomena...........................................72
8.1. Thermodynamics ...................................................................................................... 72
8.1.1. Reaction feasibility...................................................................................                72
8.1.2. CVD phase diagram.................................................................................                75
8.2. Kinetics..................................................................................................................... 76
8.3. Mass transport phenomena ...................................................................................... 79
8.3.1. Fluid dynamics.........................................................................................             79
8.4. Mass transport control ............................................................................................. 80
9. CVD process parameters...............................................................................................80
9.1. Coating uniformity ................................................................................................... 81
9.2. Coating–substrate adhesion......................................................................................81
9.3. Uniformity of coating composition ..........................................................................    82
10. Process monitoring and measurement of the CVD process ..........................................82
10.1. Temperature .............................................................................................................88
10.2. Chemical species .......................................................................................................88
10.3. Fluid flow ................................................................................................................. 89
1. Process/microstructure/property relationships in CVD ....................................................89
11.1. Epitaxial growth .......................................................................................................90
11.2. Polycrystalline growth ..............................................................................................90
11.3. Whiskers ...................................................................................................................91
11.4. Amorphous...............................................................................................................91
12. Variants of CVD methods............................................................................................94
12.1. Thermally activated chemical vapour deposition .....................................................94
12.1.1. Semiconductors, dielectric and metallic films for microelectronics,
optoelectronics or energy conversion devices...........................................       96
2.1.2. Ceramic protective coatings ...................................................................100
12.1.3. Diffusion coating....................................................................................103
12.1.4. Optical fibres ..........................................................................................104
12.1.5. Ceramic monofilament fibres .................................................................105
12.1.6. Fibre coating ..........................................................................................107
12.2. Plasma enhanced chemical vapour deposition ..........................................110
12.2.1. Process principles ...................................................................................110
12.2.2. Disadvantages and advantages of PECVD............................................111
12.2.3. Examples of applications .......................................................................114
12.3. Photo-assisted chemical vapour deposition ..............................................117
12.3.1. Photo-thermal ........................................................................................118
12.3.2. Photolytic ...............................................................................................118
12.3.3. Advantages.............................................................................................119
12.3.4. Applications ...........................................................................................119
12.4. Atomic layer epitaxy process..................................................................    121
2.5. Metalorganic chemical vapour deposition.....................................................122
12.5.1. Definition ...............................................................................................122
12.5.2. Process characteristics and advantages ..................................................124
12.5.3. Limitations .............................................................................................125
12.5.4. Applications ...........................................................................................125
12.6. Pulsed injection metalorganic chemical vapour deposition ........................125
12.6.1. Problems associated with the MOCVD method, especially for the
deposition of multicomponent oxides or multilayers .............................                125
2.6.2. Solutions to the problems using single source and special precursor
injection methods ...................................................................................          126
2.6.3. Pulsed injection MOCVD ......................................................................126
12.7. Aerosol assisted chemical vapour deposition .............................................128
12.7.1. Pyrosol ...................................................................................................131
12.7.2. Electrostatic assisted vapour deposition.................................................133
12.8. Flame assisted chemical vapour deposition................................................140
12.8.1. Flame-assisted vapour deposition ..........................................................142
12.8.2. Combustion chemical vapour deposition ...............................................143
12.9. Electrochemical vapour deposition............................................................144
12.9.1. Process principle.....................................................................................145
12.9.2. Kinetics and growth...............................................................................146
12.9.3. Comparison of CVD and EVD processes..............................................147
12.9.4. Advantages.............................................................................................148
12.9.5. Technological status...............................................................................148
12.9.6. Other variants ........................................................................................149
12.10. Chemical vapour infiltration ..................................................................149
12.10.1. Applications ...........................................................................................150
12.10.2. Methodology..........................................................................................151
12.10.3. Various CVI processes ...........................................................................153
13.Comparison of various CVD methods.................................................................156
14.Comparison of CVD with other coating techniques ...........................................157
15. Conclusions and outlook ..................................................................................159
Acknowledgements....................................................................................................160
References ..............................................................................................................160

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[书籍] 《Chemical vapour deposition of coatings》英文原版

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