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[书籍] Transport Phenomena in Micro Process Engineering (Heat and Mass Transfer)

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发表于 2008-7-25 13:16:31 | 显示全部楼层 |阅读模式 来自: 中国山东德州

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微化工中的传导现象(热质传导)共18个压缩卷,解压后35.8M
; c3 ~9 l3 h6 U# }Transport Phenomena in Micro Process Engineering (Heat and Mass Transfer)   ' A) {+ L/ H( s; M  {$ W9 p
By Norbert Kockmann
8 [$ m9 o% V* UPublisher: Springer
/ b7 ?+ v% y' b; p7 E! Q1 }, v- RNumber Of Pages: 365
" U4 r4 P8 s5 y8 D8 s$ I" h+ x! SPublication Date: 2007-10-30
# k* r# V4 ?( y5 b3 GISBN-10 / ASIN: 3540746161
$ A% Z5 u4 m, n6 [- EISBN-13 / EAN: 9783540746164 * `) f8 ~( W0 J6 v) l! o$ ~
Binding: Hardcover & Y& z+ L# o$ T* f* u. t
Book Description:   |$ B. g, b; M4 w5 T4 o
In this book, the fundamentals of chemical engineering are presented aiming to applications in micro system technology, microfluidics, and transport processes within microstructures. After a general overview on both disciplines and common areas, recent projects are shortly presented. The combination of different disciplines gives new opportunities in microfluidic devices and process intensification, respectively. Special features of the book are the state of the art in micro process engineering, a detailed treatment of transport phenomena for engineers, a design methodology from transport effects to economic considerations, a detailed treatment of chemical reaction in continuous flow microstructured reactors, an engineering methodology to treat complex processes. The book addresses researchers and graduate students in the field of chemical engineering, Microsystems engineering, and chemistry

, x3 _! d: x1 c: C8 J目录" u0 G7 e, Q1 [8 S! u5 s0 @
1 Micro Process Engineering – An Interdisciplinary Approach........ 10 T. Y' f0 W$ |$ Y
1.1 Introduction and Motivation.................................. 1" G( w7 _& A- ]
1.2 Orientation of Micro Process Engineering ...................... 2: ~" Z# _+ \2 q1 ^* Q: H. `
1.3 The Role of Transport Processes .............................. 3
+ N9 |3 E: J+ E& c5 s' `# e1.4 Main Issues of Successful Microstructures...................... 9
- {, n7 Q5 |" K2 M1.4.1 Wallheatconductivity ................................ 10
' P0 e0 w3 l. E+ t  s1.4.2 Pressure loss ........................................ 10
% Y5 v: \, Q+ }5 ^: ?' x* A1.4.3 Corrosion, fouling, andcatalyst deactivation.............. 12
, \/ O) Q2 Y" r* [# a( Y1.5 Scaling dimensions andissues................................ 13
3 t$ q5 [- A( S' X: \5 j! m1.5.1 Material properties ................................... 137 b; s' Y# t& h  X2 ?, b9 \
1.5.2 Processes ........................................... 164 C' t9 U( l; j' `+ E! s" H8 u4 v; D
1.5.3 Devices ............................................ 25+ D) d* ~! Z( r. d
1.6 ActualApplicationsand Activities ............................ 30
) H7 o  M7 V# f  G2 I1.6.1 Europeanactivities ................................... 30
: H) n+ O7 k- l7 o! q6 _, o1.6.2 Activitiesin the US .................................. 33! F5 C; v' X, N0 N! J% q, C
1.6.3 Activitiesin the FarEast .............................. 34: C( F4 J( F5 X' \& Q! s8 c
1.7 Barriersand Challenges ..................................... 38
0 [+ f) Z' ~/ H7 n! W
.............  X6 [1 N$ U$ D" A
! n) d8 Y; j1 r# s0 h
[ 本帖最后由 fenglianxiang 于 2008-7-25 13:45 编辑 ]
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