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Radiation Technology for Polymers
& b! D# b. Z2 u9 |7 u! w1 R. z# H
by Jiri G. Drobny: S0 g( I' Y# y" S4 U
Publisher: CRC; 1 edition (November 25, 2002)
' T4 F' h2 }. P pLanguage: English ; N! q( P9 b# m j) f; q
ISBN-10: 1587161087
" u) I8 @1 R3 l6 ]ISBN-13: 978-1587161087
; y" f/ Z+ u6 e: R6 ~- l) E" l: K: R, _" b& q
Book Description9 u5 m# [& j* J' t8 v! ]8 [
The industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data. 6 b( o/ t4 p7 C- E4 |* g- |# Q
5 H) Z5 G; f1 k0 _Book Info
+ c; A; } k" C; eCovers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.' N, h+ `6 S0 Q5 g
7 B. C- {$ _; K" L) S5 d
/ j" O+ o4 t( P' f4 I
Contents6 f1 q0 C' S3 w4 E; c* T0 r
Chapter 1 Introduction: V% b9 A5 M k7 Z) [- r" X2 C3 {
1.1 Basic Concepts
* u7 K) O8 M7 ]* L4 F# ]References
. @9 H; d1 ^. d, ]% GChapter 2 Producing UV and EB Energy
+ d& @0 \( J: x* u/ ~2.1 UV Energy and its Properties
1 ?8 L0 d1 z- h2.1.1 Light Emission from Mercury Gas Discharge
^9 j$ _# ?+ ^: l2 C( N; C" t2.1.2 Light Emission from a Microwave Excited Discharge
2 I4 h2 [/ o+ \- d3 ^% b, F2.1.3 Generation of Monochromatic UV Radiation5 V( a0 C$ A$ M2 d: |
2.2 Electron Beam Energy and Its Properties! b' K* ^5 `, z: N% d. c
References
5 |% o9 x8 ]8 `0 h9 f: G6 y% vChapter 3 Ultraviolet and Electron Beam Curing Equipment6 k5 U/ u; N$ E
3.1 UV Curing Equipment
7 W* A3 m' v* {! v& z% Z3.1.1 Lamps9 T7 C8 D5 z7 P ^" h7 ?% Y
3.1.1.1 Medium-Pressure Arc Lamps
) h* @7 c) H+ ~* ?3.1.1.2 Electrodeless Lamps
p. H2 m/ ^( J% h3.1.1.3 Low-Pressure Mercury Lamps& u! O% n: g# ~# m7 l- u7 N" E
3.1.1.4 High-Pressure Mercury Lamps! b: u6 u9 |# I0 u
3.1.1.5 Excimer Lamps
$ K* g! P8 Z/ Z4 \, Q% d7 D1 i3.1.1.6 Xenon Lamps
* J0 S2 d; y) x" h% I2 {1 z: f. C3.1.2 Lamp Housing4 e8 [5 |; T: Z1 `
3.1.3 Power Supply and Control Systems$ k3 P- p8 U7 M! |! l# e
3.1.3.1 Power Supply Systems; D% F6 N3 N( Z# A
3.1.3.2 Control Systems
2 T) D$ y4 T, c5 c3.2 Electron Beam Curing Equipment
. M- o& S9 ~, C* P% V. e/ G" j$ W3.2.1 Particle Accelerators. J4 L q: X" M1 m8 G) v# @
3.2.1.1 Direct Accelerators* {1 u; }+ ]' @4 r, A
3.2.1.2 Indirect Accelerators- m. I9 r& I3 W; ]0 u
3.2.1.3 Low-Energy Electron Accelerators3 A+ }* Q t. D, A& w# V# O
3.2.2 Recent Trends in Development of Electron Beam Curing$ Z% g. [( F2 @7 C+ |2 a
Equipment and Technology& o) E9 [2 i. n" z0 i0 f
References
1 H# n- L' J0 J: |% M* s
4 x5 ]# W4 X- u8 tChapter 4 Ultraviolet Radiation Processes
; ?! T% W5 ?3 c+ N( N1 n7 F% o& {4.1 Basic Concepts0 {) B/ E( T7 D G% r) J& ~0 C1 o
4.2 Photoinitiators and Photosensitizers
& }$ \( g4 p4 Y2 V4 y4.2.1 Free Radical Photonitiators
7 i9 j2 g6 l( n- L+ s/ B4.2.1.1 Type I Photoinitiators2 N1 v6 A' |3 t
4.2.1.2 Type II Photoinitiators
6 U" U) r" o+ C8 y4.2.2 Cationic Photoinitiators/ ^: D' w( U# Z6 @" D" v0 \- J
4.2.3 Anionic Photoinitiators# `! Z2 |, e4 T1 ~7 [
4.2.4 Oxygen Inhibition of Cure
( Z4 F* o3 o, p' v/ f+ O1 r8 Z4.2.5 Initiation of UV Hybrid Curing5 r4 N9 j) s% W1 L' }
4.3 Kinetics of Photoinitiated Reactions; I* l# l9 M+ ]! _- i
4.3.1 Kinetics of Free Radical Photopolymerization; ?' d/ u) U: |; P \/ t) g2 E$ Y
4.3.2 Kinetics of Cationic Photopolymerization: d5 S# {( w) b; L
4.4 Chemical Systems in UV Processing9 C( |( W* X6 f9 B0 I. G7 |; u/ N
4.4.1 Free Radical-Initiated Systems' l% \ w) |! W8 |: T
4.4.1.1 Acrylate/Methacrylate Systems
, ?4 k) x/ N. Z4 `$ u2 l4.4.1.2 Styrene/Unsaturated Polyesters
1 D: L" g" l% C+ B; H4.4.1.3 Vinyl Ether/Unsaturated Esters' g, Y2 e# `3 b( i4 t( \1 X0 j8 x
4.4.1.4 Thiol-ene Systems7 ?7 m1 D1 p Y
4.4.1.5 Donor-Acceptor Complexes
$ N# P6 k9 `. C( f4.4.2 Cationic Systems
5 ]2 Y. Z& [+ f& K3 P. B* g4 N4.5 Photocross-linking of Polymers
- `" b- X; W; g2 w3 ZReferences) V2 _" ?3 D( G" r" u
Chapter 5 Electron Beam Processes1 S1 v4 ?7 F; l% Z6 r
5.1 Radiation Cross-link Promoters
0 M8 {2 H. `% G7 z8 g# ~( B( x5.1.1 Indirect Cross-link Promoters
% |* q( ^/ u* @( t( R+ h; D5.1.1.1 Halogenated Compounds k6 ?+ Q; E Q! P0 X! M0 m6 T
5.1.1.2 Nitrous Oxide
9 u" E/ { X' j; Z/ Z9 S5.1.1.3 Sulfur Monochloride2 H- V" D" M4 E; G& L
5.1.1.4 Bases/ J+ Y2 @/ }& n0 C* w0 h+ z) k
5.1.2 Direct Cross-link Promoters/ w: g8 k& O0 ^
5.1.2.1 Maleimides
2 p- ]( V; I2 l4 W7 a" M9 V7 W5.1.2.2 Thiols (Polymercaptans)4 v# o9 I1 d4 @4 X) H+ K
5.1.2.3 Acrylic and Allylic Compounds.
7 Y; g7 C6 U0 ?& }. i/ O/ [5.2 Retardants of Radiation Cross-Linking
3 Z& J( g; `8 r9 T( K/ }! R5.3 Electron Beam Processing of Plastics
8 s1 w6 I7 r8 S5.3.1 Polyolefins. u4 l& s& [7 {1 G" X7 n
5.3.1.1 Polyethylene$ _- `5 `* F5 {
5.3.1.2 Polypropylene
6 Y+ l. b3 M8 R- B, v: Y5.3.2 Polystyrene
( T f- i+ Z2 [! J5.3.3 Polyvinyl Chloride75" \, F+ ~* P6 y" j" V5 S- U% q
5.3.4 Polymethacrylates and Polyacrylates75
# g0 H/ g( W0 W# r8 _2 a) m5.3.5 Polyamides
( g* Y3 ?# D, |7 z- I. |5.3.6 Polyesters
4 d0 a3 B+ a1 e* d4 r5.3.7 Fluoroplastics$ L+ t" C8 N) q2 s9 X- a
5.3.7.1 Polytetrafluoroethylene C# P) A2 q+ O3 |
5.3.7.2 FEP- Z* @" _+ n, Z& c
5.3.7.3 Other Fluoroplastics6 o* _: y9 c- {" r
5.4 Electron Beam Processing of Elastomers
4 \, p7 ^$ b8 i, r5.4.1 Physical Properties of Radiation Cross-linked Elastomers; y7 i- z" J6 Y- J4 t" \1 I, t
5.4.2 Effects of Radiation on Individual Elastomers d7 C6 t, s. Y/ E; w
5.4.2.1 Natural Rubber and Synthetic Polyisoprene
5 L; l5 f \! Q' \) l5.4.2.2 Polybutadiene and Its Copolymers# V: W" e7 u' Q b
5.4.2.3 Polyisobutylene and Its Copolymers2 ^( Q4 N5 k7 _1 A/ C- P: K5 V$ R. n
5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers: p$ b. o M \- Q+ w
5.4.2.5 Polychloroprene3 X7 r7 Q) P0 C* E; ~+ B
5.4.2.6 Silicone Elastomers# L; j6 \7 ?- K6 ^( q+ ^- [5 c# D
5.4.2.7 Fluorocarbon Elastomers, z5 T. ^, r# _' j6 p5 X
5.4.2.8 Fluorosilicone Elastomers2 C7 i# w" z" C6 r* G! {
5.5 Electron Beam Processing of Liquid Systems
# N/ {3 h0 K8 j1 M/ L2 }( U/ e5.6 Grafting and Other Polymer Modifications: ^0 S8 g% x: f9 D# o/ o
5.6.1 Grafting9 H* e T; Z; `! Z, K: C- `
5.6.2 Other Polymer Modifications
" a5 l! K$ G# Q. n3 K% y. y& H1 kReferences
5 z5 Z9 b2 g# m6 f& ^/ h1 Z8 WChapter 6 Coating Methods Used in UV and EB Technology
' q7 s; e* G+ i3 F6.1 Roll Coating5 ]$ D0 }( o Y) W6 Z% z) h
6.1.1 Direct Roll Coating3 n7 O& d" F3 V$ r, H0 E1 C: `4 w
6.1.2 Reverse Roll Coating' \+ q/ }3 ~. R3 d. O4 Y2 f
6.2 Curtain Coating) G+ A5 }' t% G T7 W/ ^
6.3 Spray Application9 b4 K6 i) [6 Q$ `# `
6.3.1 Compressed Air Gun Spraying
' V. ]' Z. s* T4 H2 Q% B) S6.3.2 Airless Gun Spraying
7 r0 @% t6 S% p; Q* q! Q/ S2 W6.4 Dip Coating
4 C5 M1 `0 ?9 E# |# M3 c- J6.5 Flow Coating
# t, d& `, s* W; [) r( N6.6 Spin Coating2 p2 F% l, H. n) @5 N
6.7 Rod Coating6 n6 Y) m( S6 S. Q3 E
References6 Y9 w# Y) g) D
Chapter 7 Applications of UV Radiation
R$ X2 y/ _# ?1 `# K; k) M7.1 UV Curing of Coatings and Paints3 X' ~) R' t* T% S. i7 L; `
7.1.1 Functional and Decorative Coatings
4 x5 I. A, C; }! M7.1.1.1 Coatings on Flat, Rigid Substrates
2 M! r' y$ b& d8 K0 |7.1.1.2 UV Curing of Coatings on Flexible Substrates
6 F' g# \0 t4 P5 {- B. J7.1.2 UV Curing of Lacquers, Varnishes and Paints
! W. Y7 y. y: T' E1 d2 ^7 C7.1.3 Three-Dimensional Curing" f% `- T; [0 p! {9 W ]2 Z4 z
7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts- [' C1 V8 r$ Y! ?
7.1.5 UV Matting of Coatings3 y5 K6 L% U4 d) I2 c
7.2 UV Curing of Adhesives
5 \2 n# s, b# Y7.3 UV-Cured Silicone Release Coatings
. E; D/ T1 Q5 S; m; c7.4 Spot Curing
9 k F) V/ J1 O/ ]+ f. l0 y7.5 UV Curing in Printing and Graphic Arts
3 N; f9 f$ C7 R7.5.1 Screen Printing7 C0 c& z* Z7 L5 |
7.5.2 Flexography- m, `' ]4 O: B
7.5.3 Letterpress and Offset Letterpress (Dry Offset)# W* \# e+ ]) C0 y
7.5.4 Lithography( T8 W6 c) Y/ q4 ^
7.5.5 Rotogravure Printing
* p$ j5 e) v* C1 ]6 o+ B7.6 Rapid Prototyping
/ H! U( V/ Q" K R9 w" u7.7 UV Powder Coatings0 W$ ]% z* G& L: H0 u
7.7.1 The Chemistry of UV-Curable Powders
" h5 |! z. | p: z4 k7.7.2 Material and Substrate Preparation
+ T w; b& [% O0 t7.7.3 Powder Coating Application" N5 P. t, s! Q$ e9 Y
7.7.4 Substrates Suitable for UV Powder Coating$ |* z7 b8 f& x
7.7.4.1 Plastics8 ^. x: c6 Y' I; @ P, C
7.7.4.2 Wood and Wood Composites% z4 L$ V2 ^2 \3 J3 G- Q
7.7.4.3 Preassembled Parts
/ z% m' ` b+ R2 J; K7.7.4.4 Large-Mass Parts
8 b0 c# ]" A" Q% ]3 V" n/ j1 ]6 O7.7.5 Applications4 k% p* N9 R0 b8 {% m. T$ e
7.8 Other Applications for UV Curing
1 |7 i$ U/ l% h. d" m. [& w! W$ t7.8.1 Electronics
4 x$ \" {* {0 v& A' @; Q6 b8 g! t h7.8.2 Optical Components and Optoelectronic Applications0 G( n! j4 z/ W5 ?/ z: B; |; ]5 \
7.8.2.1 Optical Fibers9 a/ h0 h( C# z* [# \) X4 ^" R
7.8.2.2 Other Optical and Optoelectronic Applications- q% h6 M% B+ I G7 u
7.9 Production of Composites8 s5 S: q3 l5 ~/ F2 A! f S, J; B- M, T
7.9.1 Dental Applications
9 F# z$ m& L" ]+ y H; u0 ~7.9.2 Other Composite Applications& H5 I6 \7 N& r- \$ F2 A
Chapter 8 Applications of Electron Beam Radiation. e) z' x& ^5 c! ?' ?
8.1 EB Processing in the Wire and Cable Technology# V' b. H1 A( p8 S' m% H$ [
8.1.1 Equipment and Process3 d; R* e2 `! I' Y" _# {+ O
8.1.2 Recent Developments and Trends
; S8 V( }" |$ ]+ A6 {4 l" k8.2 EB Processing in Tire Technology+ l0 X& j: c2 E& M
8.3 EB Processing in the Manufacture of Polyolefin Foams
0 ^* G4 }) K3 ]( }# P) t8 s8.3.1 Foam Expansion and Its Control
1 G- [" e" S/ w$ q( f* v! i8.3.2 Manufacturing Processes6 B$ S' t1 S6 K. b R8 O, x
8.3.3 Comparison of Chemical and Radiation Processes
8 H! @. W7 ~. l# P4 |9 [( q8.4 EB Processing in the Production of Heat-Shrinkable Materials
1 y- ]* B4 f/ r( d* n. J8.4.1 Heat-Shrinkable Tubing+ g: H/ s, W1 l0 V+ v8 }0 x+ u
8.4.2 Heat-Shrinkable Sheets and Films" O, l0 m9 M* R4 M/ d: v2 H" b
8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks
' n; m* |4 T: s4 L' I8 y) |8.5.1 Magnetic Media
* O* @5 g- L8 m1 t s& E& J/ j: H8.5.2 Coatings
' Y }" {8 P( c0 @$ ?8.5.3 Printing and Graphic Arts
6 u% C" Y. t! S* L8.5.4 Adhesives
/ L2 A% d8 a8 [* f) t* N8.5.4.1 Pressure-Sensitive Adhesives (PSAs), [$ f r/ V7 y- H
8.5.4.2 Laminating Adhesives
2 b: L, v3 [# q: u. h( ?0 k8.5.5 Polymeric Fiber-Reinforced Composites& o, L% I$ o: ^+ S! W( e& u: a
References
+ ~( e* o. ^, w3 x% r# dChapter 9 Dosimetry and Radiometry
) B" {# ?9 a [: z! l* c. U9.1 EB Dosimetry
8 n7 M; y$ j6 R1 x- `( K2 {' Z9.2 UV Radiometry L0 [! K9 W8 y' c
9.2.1 Actinometers" y+ A6 i4 \! k; ]
9.2.2 Radiometers
8 B& _; S6 W+ ^( X# \ }, `8 ]9.2.3 Radiachromic Films
; @1 ^5 O' h% c' z/ p% }References
3 r4 c9 Q# z+ ~' g, B, IChapter 10 Safety and Hygiene
$ w2 g- G+ J$ {4 {10.1 UV Equipment Health and Safety3 Z- s! P2 _3 `) l2 M6 p) f
10.2 EB Equipment Health and Safety
# d# C: @% P1 x2 y' p10.3 Chemical Hazards- L0 ]/ J6 _' W' e$ t+ R
References
3 o: u% v3 a( ]1 [Chapter 11 Recent Developments and Trends1 n j4 g X# t4 D' e$ ?, t7 H0 o' o
11.1 Current Trends in Equipment and Chemistry+ T& l* z5 R! \3 r" H& v/ H; z
11.1.1 UV/EB Equipment
: ~: w3 W. ~. G. I& ]11.1.2 Chemistry4 S. B/ s- X' C
11.2 Emerging Technologies. o- \0 D W4 Z" F/ g6 ^1 H- y, e3 C, z
References( Q6 p4 i6 q2 J T
Appendix I+ S! a, O# f: i4 o5 }2 q Y7 G) @
Bibliography
: ?$ z4 {+ |; ^- y+ M) @9 iAppendix II) k7 J1 a. J! c
Major Equipment Manufacturers+ s) p6 y- z6 m
Glossary
! X3 O$ g3 I* S- `3 O. n2 f u
3 ^: r( @ F4 l4 Z[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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