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发表于 2007-11-16 20:09:05
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, \9 _, n, d2 ?& Q J$ y1 c+ d16.4 Welding and Joining
Q$ u- n- m- F4 N$ {- C6 p6 rThe bonding techniques involving adhesives are* h/ J; X4 V8 U: f' s
normally suitable for applications where the fluoropolymer+ V$ ?; V7 _) j0 D0 {
does not carry large loads such as those! W' }! q8 D' _/ }5 h3 y5 i
experienced by chemical processing equipment.
; r6 ^& p) L( X: }: ?7 jWelding or adhesiveless joining is a method by which
& O6 D" B3 k3 N" gparts for load-bearing applications are manufactured.
. f: M8 l/ W9 A; A4 S+ LThe load could consist of temperature, chemical corrosion,1 a- Y( h% X- k3 ~5 C
and force. This method also known as welding" v% H4 [& L- n; A" i
or joining allows economical fabrication of complex7 b2 p' @# u% m& X+ X/ ]) J6 _
parts by joining individual components.4 s, E* |$ b9 M
It is possible to obtain a good bond between fluoropolymers
& `# ^0 E1 U: ~6 p; ]( X& Dthemselves, without the use of adhesives,' g' X0 v, H+ n5 G& D. y
by application of heat and pressure. Pressure can help3 n! X E0 ?* X/ e
drive the molten polymer into the pores of the substrate.* m# u0 d, [: b: B, ?8 ?2 v. U1 z/ e/ @
Bond strength is dependent on the mechanical
8 q3 `$ r; b% c* x4 J9 t6 C+ Winterlocking that is achieved by the adhesion mechanism,* i9 i9 f2 u7 @1 G. T% _
improving with increased surface roughness of6 R* b2 r- i6 t* @3 _2 w+ E: [8 p
the substrate. Examples of parts made by this technology
) Q+ T5 k- ~ Y! l4 [include glass cloth-backed polytetrafluoroethylene
. V% x% E& F; Y asheet, or multi-ply circuit board and coated
: x* G6 y# \( q$ _) Paluminum or copper sheet. Achieving this type of
; ]4 u, v2 e$ \% Lbonding is more complex with polytetrafluoroethylene
9 W1 A% W1 y/ C& p$ zthan melt processible polymers. PTFE does not flow; ]) I$ |# ^. J& q
after melting due to its extremely high viscosity.. O( A6 D) B p9 h
It is possible to achieve adhesiveless bonding using. k0 M: H. |7 v! ?+ |( o8 i$ N) ?7 W
standard PTFE in special applications where the
) u; K0 Z5 I. l" ^" R' k. I' }5 spolymer can be heated to a temperature well above its
2 S* V( C6 U! S. b B: V4 Wmelting point. It can then be forced under pressure% d1 q1 {% R+ M1 I! d
into the substrate surface. These polymers are not' T$ M5 L6 f7 _
suitable for applications where the geometry of the6 a. A6 v$ D! z h
joining objects must be preserved, contact surfaces: o P. e6 e3 m+ g# K' Y
are smooth, or the objects being bonded are too large.: W9 S x6 s) L" h
In such cases, a different type of polytetrafluoroethylene
: |+ S7 d% N% V3 o1 Tis required.
$ R1 Y4 s# J | X& x, B2 s9 J; VPolytetrafluoroethylene for these applications is1 i8 i9 G0 W# x( F i2 z8 m/ v+ u
known as “modified” which refers to the presence of
3 T, Z/ @5 A6 U2 _5 Ua small amount of a second perfluorinated monomer,
- a0 f! ^1 R/ i& j+ ?3 Iknown as a modifier, in its structure. The modifier
6 t, U3 L! e1 q. R( X! tmolecule always contains a pendent group. The
) v' \ [% ]) B" h2 T4 k. w$ ~0 \2 Rpreparation method of this type of PTFE has been described
5 T7 c% e8 r7 d3 z& Q& K! Gin Ch. 5. Its commercial grades have been
, s0 P( A' Y/ Kdescribed in Ch. 6.
3 s1 i5 u3 S' b/ F2 Y6 D. RHow does it work? A simple explanation is offered
1 f: |7 L9 u! R) M+ rhere, based on the author’s own experience. The/ b8 ]& b) J$ l6 d1 j/ K% p/ J w$ I
modification reduces the molecular weight of the polymer,( u3 u) C$ w! y. Y) X
which in turn reduces its melt viscosity. Lower; D" m2 K/ a- b- ^
melt viscosity increases the mobility of the polytetrafluoroethylene
" ^1 E! t# F+ Wchains. This facilitates diffusion and
; L1 n) v. p/ p0 U/ A, `entanglement of polymer chains at the bonding interface./ M/ u$ Q9 B& _ Z8 V
The pendent group of the modifier disrupts the0 J% z, Q/ b! \
crystals of PTFE, thus preventing excessive crystallization.
0 }3 x+ T( J0 p5 l8 M, `) i M* GCrystallinity which is too high results in poor
; j8 s: s( `' D# p/ Ymechanical properties such as poor tensile and flex. q( h: x+ w7 I$ w* B# _3 Z7 E
properties. An optimally modified PTFE has good. N0 s/ F" n+ z' x" h; z" o7 Z
mechanical properties in addition to weldability.
% T5 x X- S) o& YWelding can be achieved using PTFE made by
: j. Z1 R# b6 |+ y& ndispersion or suspension polymerization. Most applications( ~ h$ B2 t( T" m2 B
involve welding of parts made from granular) s" k$ X2 q+ o5 D/ A! e
resins (suspension polymer). Dispersion polymerized4 U. v' F4 B# G! ?; ^
PTFE is also used for application such as wire
! p* M# a' y0 N' X& zcoating. A thin (50–100 μm) tape of the “modified”1 Z# E! s1 w( z) y; |
polytetrafluoroethylene is wrapped around the conductor5 J$ L, j& h1 R
followed by sintering. The layers of the tape
! }, O) H! [5 a. ~) m/ ^2 ladhere to each other and form a solid insulation, due
7 ?4 d0 X/ ^8 \* xto its good interlayer adhesion, around the conductor
0 N% E/ `: \+ [at the completion of sintering cycle.
8 J1 t5 o g6 o% d16.4.1 Welding Technique# |1 V' h; r2 ]
Quality of a welded area is defined by the strength' p8 E; J4 ?/ q4 S8 t6 j0 T0 D# u n7 A: Z
of the bond. One of the ways to measure bond strength- q, r, o+ O e$ [
is to cut a microtensile bar specimen in such a way
; [9 V: o4 Z+ m: xthat the weld line would fall near its center (Fig. 16.5).
# K& S; ^, k# K& |5 d1 WTensile strength and elongation can be determined by
/ R" l1 D: t2 d, r1 a% _- eextensiometry. Weld factor is defined by Eq. 16.1 as
% K; ]3 ~. S2 P0 B8 f) C) Vthe ratio of tensile strength of the welded specimen7 A) P( e% A3 I/ T: W# N9 s
(Tw) to the tensile strength of the material (Tp). The, V# V8 | w/ ?. m. g
weld factor is defined for the weakest polymer, if two. N6 u$ W r* i7 A+ d
different polymers are welded together.
' e9 c y: M9 ?( p8 Y4 T& T( YThree variables are significant in welding a given$ b6 p( Z7 s1 Y' }
modified PTFE part: welding temperature, pressure# k' C8 w; a+ i- G6 N# b5 B
and time. Optimal combinations of these three pa
* H2 t' d8 M$ ?; `rameters must be found for successful welding of parts.- F; r* @& ?. W9 E% w
Temperature should be well above the melting point7 T4 F# m( y9 s U
(320–330°C), typically in the range of 360–380°C.* `0 d; L" l( D5 N/ k* m; C# }
Little pressure is required to weld the parts after reaching) F1 V+ y8 C; ~8 F" h ~& ]
gel state. Less than 350 kPa, and often less than
5 k8 D% N4 F& {4 s: I35 kPa, pressure is required for welding. It is normally' {, {# y) f# B( T% _0 b, B
not possible to trade higher welding pressure
" A% ?; R0 y1 m8 a: u8 z0 Bfor lower temperature and vice versa. Time, the third
; [9 [9 H% R7 \variable of the process, is dependent on the size and; }. M7 V3 F: ]
shape of the part. The actual weld time, defined as5 C5 T1 E. j$ z+ e5 _
time at the final temperature, is of the order of 1–2& M+ o9 [) e3 @9 l x" f, ^/ _
minutes. It often takes a great deal longer to heat up
- D+ Z1 y, S" r3 H) J& O5 N' y2 y) Ythe part to the welding temperature. High heating rates6 u, t* E* _! `$ L0 I
do not accelerate the process due to the low thermal
# A0 G0 O& [0 o7 L( Zconductivity of PTFE. Heat rates similar to those of
, F# b( K: F/ C- ]6 z) [4 lsintering cycles of preforms can be expected.5 |' N9 T7 I+ d' W7 p
The mating surfaces should be smooth and uniform! X/ K2 t I k; E" O( O0 h
and free from any contamination. Unsintered
: X0 I5 e/ E2 F- M9 Q- F2 ipreforms and sintered parts of modified polytetrafluoroethylene7 _- q" `# j# G& {
can be welded. Sintering and welding can" | b, z6 h! I9 t0 G
be combined. Parts can often be stacked up in the. E4 P$ i" s+ @. M( _8 {+ ?5 e
sintering oven without additional pressure. A weld
" e! L6 n' T* Mfactor of one can be routinely obtained in the combined
( ]" c" H) z: h/ bprocess. A higher pressure is required for welding
% V, z3 `5 `. [) z, m/ h6 fsintered parts to counteract the residual stresses,7 ~8 |& j5 N4 h- D% ~
which tend to move the parts upon release. It is important- o. i8 Z/ P- b: b5 f7 q9 Q0 c/ m
to cool the welded parts slowly to minimize0 }4 U. S5 v0 z0 q# S, z+ j
stresses stored in the part. Figure 16.6 illustrates a1 Y- @* d5 i R, V/ x8 u
device for hot-tool welding films and sheets.
* ?$ Z2 [/ {0 K. O QFigure 16.7 shows a comparison of the stressstrain
" o* ]# o' k! A+ ^; q) m Pcurves of a conventional and a modified PTFE$ g% G" t8 ~# k/ ]! [
for the original and welded material. The weld line in! A7 j' h4 g* ^8 u% }" f
conventional PTFE when welded to itself, at best, fails
, I4 B+ P, I( S% rat very low strains. In the case of modified resin
- @1 L; r/ U: h$ `- E1 Owelded to itself, the weld factor attains value of 0.80–
% }( P' n0 \* v, ^2 \! E$ h0.85. Weld factors for welding of conventional and
- ?& c0 G5 g N% E$ D! Fmodified PTFE have been reported in the range of! Z3 i+ a5 Z" r; j$ a6 [& X
0.66–0.87.[13]$ e; Z3 E# O+ S0 |: p* t3 h7 r
Another method is welding with the help of a PFA
" {( O) Z8 Z$ y6 h* W8 o(melt processable) rod. In this case, the conventional
/ [8 L5 i* N" Bor modified PTFE is heated by hot air near the seam' i7 P: N' Q( Y' [% o) r: [
until it is in gel state. The PFA rod is molten and used
* V( ?9 H3 B) G* U vto fill the seam. |
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