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HIGH-PERFORMANCE CONSTRUCTION MATERIALS:Science and Applications" ^( N" u9 A5 O) [
! K" e# V, \3 ^3 ~8 G6 W. L) |
Copyright © 2008 by World Scientific Publishing Co. Pte. Ltd.
! Q4 {/ ?- ` t* t; Q( v0 T$ ?& b% p0 {! o+ v9 G
All rights reserved. This book, or parts thereof, may not be reproduced in any form or by any means,
. Z6 h8 A9 f& q7 h8 a* Melectronic or mechanical, including photocopying, recording or any information storage and retrieval
$ u0 o I1 O7 a" t2 d: `; lsystem now known or to be invented, without written permission from the Publisher.
9 m: J* n8 Y/ c' y7 a* N4 m& x. S! i+ i4 K4 o% h( b
Author:D.D.L. Chung Book Series Editor Buffalo, NY, U.S.A.
# Y0 Y3 \, \5 D9 z W( o
1 R8 r5 C8 i5 ?1 q% g* L( |This is the inaugural volume of the book series “Engineering Materials
3 ~: j* Z! W8 U( h" @! Ofor Technological Needs”. The technological needs relevant to this; u1 u6 Q* e1 t
series include those that are related to the electronic, optical, magnetic,
G6 V: Q, A1 [thermal, electrochemical, energy, environmental, structural, construction,9 c4 }, c W$ P* m
aerospace, automobile, security, manufacturing and medical industries.
8 J! {% q9 j; PEach book in the series addresses materials that serve various functions( l0 [4 U" F( V3 a0 {$ G# A$ G
in a particular area of technological need by describing the relevant
3 n. H0 b6 |0 Jscientific concepts, the status of the technological need, the limitations of
! _3 u. M# W2 O" Mthe technology, the pros and cons of the materials available, how the
7 g: {" ] t. f9 Ymaterials are applied, evaluated and fabricated, how various materials are0 c8 T/ e; f& c; p* W1 y- B, c
integrated to form an assembly that can be used in practice, the( W# C$ t* U; @! a! d
performance and durability of the competing materials for each specific* ?# }: o% F& L" V6 m9 W
application, and the future directions.- w6 e2 c% ?8 c+ A6 P
The books in this series differ from other books in their emphasis on
# G$ @$ ~6 }8 c: |2 ~materials for technological needs. Existing books in the materials area5 N$ Y, K$ C t: ]% B; V. m' x
largely focus on the fundamental science of particular classes of2 a6 w8 l* H! y% }
materials. The material classes in these existing books tend to be
9 f, t) W! O# [2 ~; p* [' _" Gdistinguished from the viewpoint of science rather than the viewpoint of
+ `, x2 a# `8 b2 H: H6 s& Z% Vapplications. In contrast, from the viewpoint of a particular application,- H# G$ T6 {) `# M" y" L
the relevant materials may include metals, polymers, ceramics,8 | H, d0 M! t
composites and semiconductors, which constitute the traditional classes
6 w% y1 A0 N/ J( G, Tof materials. The impetus of scientific research hinges on the success of# {& s& Y( Y# `, a& Y& ?" \9 q& |
applications. It is important to develop materials for applications rather
5 S0 t6 B2 w8 F& o7 M D4 ]than just studying materials for the sake of advancing the science of9 y" Z, T/ o4 b, o+ O
materials. In spite of the obvious importance of the linkage between# V) t# [9 Z3 n
science and applications, this linkage has long been weak, due to+ x$ k( R! L; v3 M2 x3 x
insufficient communication between the science community and the% \' T6 b; ? p0 I
application community. This book series is intended to alleviate this
# S* ]( ]) B5 p) ?* qproblem by addressing materials from an application perspective. The. s$ j9 o( ?7 f$ M m# W9 ]6 a: \
books do not assume prior knowledge of the applications and require from its readers the equivalence of only one introductory course in6 Z# K/ n7 D0 y; F, s
materials science. Due to the tutorial nature of the books in the series,
# a; t x1 ?8 g; \: ]' C7 [; mthe books are expected to be useful as textbooks in undergraduate and! F6 ~7 w& D# S& o* \
graduate levels. In addition, due to the timeliness and importance of the
/ J; {: Q' D1 B; m, Gtopics and to the inclusion of an up-to-date list of references, these books
, X* i) s4 J! y# v6 Sare expected to be used by professionals as reference books as well.. m: Z q; e; o8 ~3 ^
9 @9 S+ |6 Q4 {2 |# O......7 w7 x/ E* o3 @4 ^
4 y# ]4 r [# B I* G[ 本帖最后由 mwmwmw 于 2009-5-13 07:57 编辑 ] |
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