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[已解决] 请问有谁能说说铁佛龙是怎样焊接的??

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发表于 2007-10-19 15:29:02 | 显示全部楼层 |阅读模式 来自: 中国陕西西安

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我们做线路板设备的,有时用到铁佛龙这个材料,不过由于焊接技术的不成熟,使用时有很大的局限性,在三维上看能不能找到一些好的解决方法!
发表于 2007-10-19 20:56:17 | 显示全部楼层 来自: 中国辽宁沈阳
聚四氟乙烯在熔点以上(380℃)其黏度仍有1010~1011Pa·s,即使加高温度也只会分解而不流动,因此对聚四氟乙烯材料的焊接区别于其他热塑性塑料。聚四氟乙烯的焊接有热压焊和热风焊两种,热压焊接是将焊接的两片PTFE材料加热至高于熔点,在不太大的压力下,将两片材料压合在一起。热风焊接是用与聚四氟乙烯性能相仿的熔融加工的氟塑料如四氟乙烯-全氟烷基能乙烯基醚共聚物(PFA)作焊条,用热空气将焊条与待焊的聚四氟乙烯同时加热、加压,使聚四氟乙烯材料通过焊条连接在一起。

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发表于 2007-11-16 18:40:38 | 显示全部楼层 来自: 英国
? 基本不能焊...2楼说的只针对膜...厚点就不行了..
' J+ S/ X2 c- u能具体说说电路板哪边要用PTFE? 如果是加工PTFE电路板..怎么会需要焊接的?
发表于 2007-11-16 20:09:05 | 显示全部楼层 来自: 英国
查了下..还是可以焊的..把资料给你..( ]& ~; o  D0 q
16.4 Welding and Joining8 u! ^1 O/ S0 J1 `0 y+ c$ {! H$ l. b
The bonding techniques involving adhesives are5 x/ T& l$ b' U
normally suitable for applications where the fluoropolymer
" b/ \; e  L; r& kdoes not carry large loads such as those8 h7 e- |  q: B  a% f
experienced by chemical processing equipment.
- h% }5 V( y# f$ k; F. E' ^# l( A2 oWelding or adhesiveless joining is a method by which* N9 f7 v  J* u( B
parts for load-bearing applications are manufactured.
7 [$ O" |5 s4 j( S' |The load could consist of temperature, chemical corrosion,5 i; W2 y5 E: Y
and force. This method also known as welding
" o# L( t% k" v- H1 h- Jor joining allows economical fabrication of complex  O9 |5 q/ M( J9 I7 B
parts by joining individual components.
: p; d: W1 @6 b/ ^$ R- G5 M4 `It is possible to obtain a good bond between fluoropolymers& W* o( ]% |( P$ P7 ?8 u
themselves, without the use of adhesives,6 @2 B4 l4 F+ h' K  L
by application of heat and pressure. Pressure can help7 B' }2 x- u. g  V/ q( e" S
drive the molten polymer into the pores of the substrate.
3 g. w7 l- q/ Z$ {8 tBond strength is dependent on the mechanical7 {* N, S2 H2 F+ L* x3 k
interlocking that is achieved by the adhesion mechanism,
& T! ^2 c& V3 y+ K+ Aimproving with increased surface roughness of
" H1 _: v% K" Gthe substrate. Examples of parts made by this technology) p+ l* J8 n' p8 C
include glass cloth-backed polytetrafluoroethylene
7 p% ?0 j; y* gsheet, or multi-ply circuit board and coated3 e& B1 l; ~4 x3 D1 y, d
aluminum or copper sheet. Achieving this type of
% W2 n  y) o0 k* f1 F5 pbonding is more complex with polytetrafluoroethylene" e9 J/ _6 j# n" y7 ?9 x7 S
than melt processible polymers. PTFE does not flow' i. d% ?; \- n5 m/ ]: J% }
after melting due to its extremely high viscosity.
7 A" g$ D3 D+ B- oIt is possible to achieve adhesiveless bonding using
* l. {( S0 i% c$ ~4 V' V& Gstandard PTFE in special applications where the
6 q4 \' K9 J1 {( X5 d7 r2 e8 Dpolymer can be heated to a temperature well above its( x4 K- C% H: a6 O" R
melting point. It can then be forced under pressure
1 j5 ?* N9 h/ N  L, d" b  winto the substrate surface. These polymers are not# D0 I+ u+ ^# e$ B6 ~
suitable for applications where the geometry of the
, R+ F. o) w/ Y) v/ V9 Xjoining objects must be preserved, contact surfaces
- F0 i6 H  q7 g/ P: K+ o/ G# Sare smooth, or the objects being bonded are too large.
) Q3 i9 R. e1 }) L8 D1 AIn such cases, a different type of polytetrafluoroethylene
; h( _+ `) m) \is required.6 Z2 o' |. [- V( {4 h5 p
Polytetrafluoroethylene for these applications is
; Y& v& d# M/ L, R1 @known as “modified” which refers to the presence of5 c) `  j, O- S7 i4 P! i
a small amount of a second perfluorinated monomer,# Z5 A: y3 ], f+ j# S
known as a modifier, in its structure. The modifier
) Y; m6 w# H1 Q& ^% imolecule always contains a pendent group. The
# x4 h6 F& ~% f3 y5 ]$ wpreparation method of this type of PTFE has been described
, C4 D; @  w! v7 N- ?: rin Ch. 5. Its commercial grades have been1 m% o0 _& w- f
described in Ch. 6.
* R5 V/ s( m) R  A/ a9 a# UHow does it work? A simple explanation is offered, d+ ~+ X& c' j- s
here, based on the author’s own experience. The1 R, d& ~3 I) K$ s$ `, b
modification reduces the molecular weight of the polymer,0 U0 `8 i, Z! i
which in turn reduces its melt viscosity. Lower4 D- @: `7 ~& s0 G( t- E* F# {
melt viscosity increases the mobility of the polytetrafluoroethylene
, X* Y) b# }6 C: j6 E6 mchains. This facilitates diffusion and: u5 H. U4 ~6 W; {; c* j: j/ ]" \
entanglement of polymer chains at the bonding interface.
# g3 d8 D3 X5 o- S+ l$ nThe pendent group of the modifier disrupts the
( c3 i) p9 n5 X. H& k4 C4 @' Xcrystals of PTFE, thus preventing excessive crystallization.0 g$ p9 H& e7 B( Q
Crystallinity which is too high results in poor
& L4 r7 h4 c0 Tmechanical properties such as poor tensile and flex
! I4 C# r: g  H" t, [% M: bproperties. An optimally modified PTFE has good
$ c; {3 O1 i: t! Jmechanical properties in addition to weldability.
2 R6 w$ d* {+ m# u* L5 b  B+ g0 `: \Welding can be achieved using PTFE made by
0 N( w9 n  |) Ddispersion or suspension polymerization. Most applications0 L# t$ P4 [7 X
involve welding of parts made from granular
) w6 w: z6 f& E9 tresins (suspension polymer). Dispersion polymerized3 Y, Q- D$ v6 x" m$ [1 c
PTFE is also used for application such as wire
3 ~. }" @  C* X( h2 r+ kcoating. A thin (50–100 μm) tape of the “modified”3 C' ]4 o0 s0 X' z. Q& w6 F
polytetrafluoroethylene is wrapped around the conductor
% g" X, ]0 j# p, a  Pfollowed by sintering. The layers of the tape
$ |5 `0 H: ^" v# d0 u; madhere to each other and form a solid insulation, due
: m: x; U- f5 U2 R; ~: J7 b! Lto its good interlayer adhesion, around the conductor' j$ P6 V( c4 s, k: Q; U
at the completion of sintering cycle.+ l. `( Q$ t0 S7 C6 a  X* _+ {9 @
16.4.1 Welding Technique( c, Z& l$ |- V3 E1 g' \
Quality of a welded area is defined by the strength4 B9 ?' f7 O% }. N4 q$ a
of the bond. One of the ways to measure bond strength: h# X2 h) J3 ^- [
is to cut a microtensile bar specimen in such a way# ~  s9 j5 n  x# g
that the weld line would fall near its center (Fig. 16.5).
$ i4 Y  O1 Q' K0 x, J5 o' ~/ h+ VTensile strength and elongation can be determined by
# @5 {- T5 c7 A. d. ~extensiometry. Weld factor is defined by Eq. 16.1 as
' p9 d5 v  V& B3 Sthe ratio of tensile strength of the welded specimen# _( l4 r' E: W* T- Q. u. p& f
(Tw) to the tensile strength of the material (Tp). The5 \( u4 r# @4 @
weld factor is defined for the weakest polymer, if two% S" @9 Q" \5 P. m
different polymers are welded together.. ~6 o) ^5 j3 A* X9 n* \
Three variables are significant in welding a given
  f8 _1 J. W! Z& \# Y. J9 smodified PTFE part: welding temperature, pressure
4 ^! Q  p1 {/ X- S) o! |( Iand time. Optimal combinations of these three pa* T4 D5 S+ y( D. ~" T
rameters must be found for successful welding of parts.% w  y& n; J, H; X1 K; h( y
Temperature should be well above the melting point
- h$ p( X  q" @3 X(320–330°C), typically in the range of 360–380°C.% F: J$ l* G8 l# h# V
Little pressure is required to weld the parts after reaching
+ w2 z5 R0 f/ p+ K& ogel state. Less than 350 kPa, and often less than6 v8 s! b7 v! `! M8 V: V* B: u
35 kPa, pressure is required for welding. It is normally
: M8 c% h7 }7 |9 i; L) p1 C' tnot possible to trade higher welding pressure
9 I; D7 ?# R: @, `6 p  @for lower temperature and vice versa. Time, the third+ P& w5 v8 z' R! |1 n/ c# g
variable of the process, is dependent on the size and; Y, y9 u; a' N% \- o1 P9 ]
shape of the part. The actual weld time, defined as
1 L% |$ J/ w  itime at the final temperature, is of the order of 1–2$ ^# h7 \- L7 v4 h6 E/ G3 ]" ~7 P6 ~3 k
minutes. It often takes a great deal longer to heat up% D+ T$ [, P' d1 w. i- Y* d( l
the part to the welding temperature. High heating rates
8 M  _: B7 r8 a7 n8 y/ Y7 L7 H& fdo not accelerate the process due to the low thermal
" Y8 \5 q9 n; q1 r# cconductivity of PTFE. Heat rates similar to those of
% @8 @- T* C) r' O- V( k8 Usintering cycles of preforms can be expected.2 Z7 v  b! l) H
The mating surfaces should be smooth and uniform3 ~3 i* L' Z( [0 Y9 u4 h) ]' I
and free from any contamination. Unsintered8 h5 X; P. ~. g3 T
preforms and sintered parts of modified polytetrafluoroethylene
' o' }' a# \; B% R3 N; Hcan be welded. Sintering and welding can. ]5 d$ V, X( Y# H9 X% D' w/ j
be combined. Parts can often be stacked up in the
& b% {& B; Z, M/ b7 b/ R! s  [sintering oven without additional pressure. A weld
+ J& u9 ^. g, U% _: v6 Ufactor of one can be routinely obtained in the combined2 o% w/ M. P2 N1 A# E8 y$ {# y
process. A higher pressure is required for welding
6 ]' C. D; K9 a# wsintered parts to counteract the residual stresses,
5 z2 x& \$ \, L; d* w3 r3 pwhich tend to move the parts upon release. It is important' z. b1 U# H# E' [  g, A- [. D4 F0 c# y
to cool the welded parts slowly to minimize, ~" h6 G' A" b, z" d
stresses stored in the part. Figure 16.6 illustrates a
7 Y, R9 W% C+ A, ddevice for hot-tool welding films and sheets.
' P4 Z) ?: A5 c- t- u* o' I) q" xFigure 16.7 shows a comparison of the stressstrain
& H5 M+ U9 n: p4 ?! e. P( x! m4 v+ }; bcurves of a conventional and a modified PTFE
) D' Z& e& G! j9 q9 E. R2 L! xfor the original and welded material. The weld line in
- J4 f' O7 X2 s6 ^+ o% ]* Xconventional PTFE when welded to itself, at best, fails
1 `: N) t$ |" d, f4 xat very low strains. In the case of modified resin
0 B9 W; L7 [" b, V" Kwelded to itself, the weld factor attains value of 0.80–
7 \5 s! j( e2 t0 [! Q$ e0.85. Weld factors for welding of conventional and
! r' k  i* _8 R  rmodified PTFE have been reported in the range of$ E4 f6 Y8 Q( G! N& }3 {
0.66–0.87.[13]
$ s3 s" P4 A; m/ k$ i: dAnother method is welding with the help of a PFA& x! N8 Q- E' u1 v9 w3 E4 s1 ?
(melt processable) rod. In this case, the conventional
' N" p, p: N4 qor modified PTFE is heated by hot air near the seam" o, k+ F1 T: c  }  W0 v% u. V
until it is in gel state. The PFA rod is molten and used3 L0 ]. f* N4 k3 E4 |+ `
to fill the seam.
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