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Radiation Technology for Polymers
- P# [5 u) g, `6 X; d, o: ]5 b
) j5 }4 m* z1 B7 Aby Jiri G. Drobny) [7 g. Z" E+ u" Q J2 _) k
Publisher: CRC; 1 edition (November 25, 2002) ! S6 j1 `% t8 {6 A: @3 e
Language: English 0 C5 n/ R! U! A& ]) y
ISBN-10: 1587161087
. R& R- y$ [- x1 oISBN-13: 978-1587161087 / v. G; r2 t6 C3 _, U
" A' |1 E2 G- t7 h0 ^5 E$ K* P% ?
Book Description
1 c n5 q9 z9 v0 [0 s3 L- {The industrial use of ultraviolet (UV) and electron beam (EB) radiation is growing rapidly and now penetrates an ever-widening range of applications, including electronics, printing, packaging. Resources and references for seasoned professionals abound, but few effectively introduce the field to newcomers or provide fast access to specifics on UV and EB effects on particular materials. This book does both. Radiation Technology for Polymers systematically presents the practical aspects of using UV and EB radiation to treat polymeric materials. Drawing on more than 30 years of engineering experience in polymer processing, the author describes the production and properties of UV and EB energy, explores processes associated with both types of radiation, and provides a detailed overview of their applications. He concludes with a look at recent developments and emerging trends in equipment, chemistry, and technologies. Whether you are an engineer or scientist new to radiation technology or a product or process designer researching the effects of radiation on a specific material, Radiation Technology for Polymers is the place begin your search for information. It offers a complete overview of the technology and provides valuable direction to sources of more specific, detailed data. , f, f# T$ T6 R* X( x) o, O( P; D
2 X6 ^9 O0 [# Q" D$ X
Book Info
, \/ i9 Z7 @1 H* V0 J! pCovers the processing of thermoplastics and elastomers in film, sheets and other forms as well as coatings, paints, inks, and adhesives. Presents detailed reaction schemes in a simplified manner. Offers a complete overview of the technology of radiation processing.
% y+ e( _$ L) Z9 Y* B' w0 G$ c C' r# w. F2 O1 S
4 U o8 h$ A3 r, [Contents
; g" e9 U! V x- UChapter 1 Introduction
. h, C1 l, ^, r. a5 Y2 s# m1.1 Basic Concepts
6 Y9 z b$ W) q2 o2 dReferences
7 C1 d4 j, w5 rChapter 2 Producing UV and EB Energy3 a% b. X5 E( I& z+ y( \
2.1 UV Energy and its Properties
0 z1 [1 O; o. K7 f% ?- }) G: p2.1.1 Light Emission from Mercury Gas Discharge
, J8 L, [. G6 d- a; K% q- Z5 @2.1.2 Light Emission from a Microwave Excited Discharge4 N3 I9 M" v9 A" D, _
2.1.3 Generation of Monochromatic UV Radiation
1 X A* c( k- K" ~! x4 {( Z2.2 Electron Beam Energy and Its Properties4 E( O; c9 e5 `4 P
References
1 ]! f# I9 v9 FChapter 3 Ultraviolet and Electron Beam Curing Equipment) C0 ?* x6 T) V
3.1 UV Curing Equipment
n- ?7 `8 _; ], t( X9 K$ o3.1.1 Lamps1 l8 w. Q0 B l( g' t
3.1.1.1 Medium-Pressure Arc Lamps
& K5 e9 M$ R9 H3 ^3 v3.1.1.2 Electrodeless Lamps4 r. B- E$ k1 Q' w" q
3.1.1.3 Low-Pressure Mercury Lamps x. Q$ G5 ?6 k2 o* \4 J6 \
3.1.1.4 High-Pressure Mercury Lamps5 S' ^( M# g$ m. M
3.1.1.5 Excimer Lamps# Q6 @: y/ k$ [. w& l. p; n1 O5 c
3.1.1.6 Xenon Lamps( q1 ?3 t0 s2 k
3.1.2 Lamp Housing2 V4 V4 K D8 ^8 d7 q$ L' D! ]0 m
3.1.3 Power Supply and Control Systems. h0 r3 K6 Y# N9 l
3.1.3.1 Power Supply Systems
N% r# D+ @! n; H# X" a3.1.3.2 Control Systems* R% H$ K0 I! c1 r# h; V$ c5 V
3.2 Electron Beam Curing Equipment$ a- e+ l1 i1 g; b1 Z+ P
3.2.1 Particle Accelerators* x; c. b% t) N) h( I# U3 ~
3.2.1.1 Direct Accelerators0 S( |* K, {( w( |
3.2.1.2 Indirect Accelerators
+ m) m1 q6 [9 u3.2.1.3 Low-Energy Electron Accelerators8 B2 i4 G! X% b c; A
3.2.2 Recent Trends in Development of Electron Beam Curing' ?+ V. r% M2 R) O
Equipment and Technology
4 C( W& f& G6 s- G$ R+ w$ hReferences
/ O/ e1 \0 ?$ E$ Q. [) u8 S. B+ b0 k% x. Z
Chapter 4 Ultraviolet Radiation Processes W! H; J! l! F: V! j
4.1 Basic Concepts% U/ p0 h$ L! n6 r7 r
4.2 Photoinitiators and Photosensitizers/ C6 r$ c( W$ B* I7 P
4.2.1 Free Radical Photonitiators
2 {$ g6 a" J4 H4.2.1.1 Type I Photoinitiators
# m3 i' U. m' H4.2.1.2 Type II Photoinitiators* M- @1 @" L4 V- d
4.2.2 Cationic Photoinitiators
- ]& c/ _3 D T" t' }! k' l4.2.3 Anionic Photoinitiators
9 Y9 l1 ^9 c1 m; X4.2.4 Oxygen Inhibition of Cure7 H5 }" ~ J4 \8 [4 W
4.2.5 Initiation of UV Hybrid Curing8 S4 L$ `! u6 i* n4 m
4.3 Kinetics of Photoinitiated Reactions$ R" q9 g3 o% T, e3 b+ I% Y; W
4.3.1 Kinetics of Free Radical Photopolymerization
$ C. {' I" g% U: a4.3.2 Kinetics of Cationic Photopolymerization
9 [. m: b8 i n$ c6 e) a+ q$ t0 d4.4 Chemical Systems in UV Processing& f0 T7 I3 }: L' u5 d" |
4.4.1 Free Radical-Initiated Systems$ E3 A5 }3 Z3 q& l6 T% ]
4.4.1.1 Acrylate/Methacrylate Systems
- h; `: h+ ?7 F& p4.4.1.2 Styrene/Unsaturated Polyesters
4 {/ A8 y+ t* n% f$ X5 l" ^. ~* w4.4.1.3 Vinyl Ether/Unsaturated Esters
0 t1 [- G* D; y4 @0 U! L! a4.4.1.4 Thiol-ene Systems/ E; [# i$ b5 V* P7 k1 q0 i, r1 {: ~
4.4.1.5 Donor-Acceptor Complexes: A1 [2 Y2 R; h" m3 f T
4.4.2 Cationic Systems- b } J% C4 c0 e2 [; }# |
4.5 Photocross-linking of Polymers
* y/ T9 i) y, g1 p+ X, TReferences. _4 w" O: X8 w0 a5 F
Chapter 5 Electron Beam Processes
- V& c$ g7 Q/ g6 m) G1 I0 S R6 J5.1 Radiation Cross-link Promoters
6 U) s! j2 P$ ~! F% ?5 k5.1.1 Indirect Cross-link Promoters" `# q/ \# Z7 [
5.1.1.1 Halogenated Compounds2 x9 d; i- z4 ]8 y* b. L2 I
5.1.1.2 Nitrous Oxide
" ^; _6 `% s, n' H! _6 p$ i8 d; E$ J5.1.1.3 Sulfur Monochloride
3 n1 s5 q& o; m0 }( n! ^5.1.1.4 Bases
6 i, x- B6 H4 p S5.1.2 Direct Cross-link Promoters0 x1 b) E7 D9 W$ p
5.1.2.1 Maleimides& a; P6 w) f: m2 f1 u* i3 Y
5.1.2.2 Thiols (Polymercaptans)' W* B _; I9 ~6 h
5.1.2.3 Acrylic and Allylic Compounds.
' k7 e# p/ w" `0 r5.2 Retardants of Radiation Cross-Linking5 c' E+ K+ h+ p e
5.3 Electron Beam Processing of Plastics
6 b. c; h! H8 Y4 _. X' g, I' @5.3.1 Polyolefins
) p2 \# g7 ]8 q7 {. F+ P8 n5.3.1.1 Polyethylene
( I3 W" z, j M5 ~" z5.3.1.2 Polypropylene' k- d& }5 [# Z/ @
5.3.2 Polystyrene
1 \/ ]' j8 }: D) k ^4 X5.3.3 Polyvinyl Chloride753 F* l6 y5 ?1 _, m
5.3.4 Polymethacrylates and Polyacrylates75: o* e$ D. _ i5 f0 m
5.3.5 Polyamides
$ `% K% d5 |, @5.3.6 Polyesters
" x+ f2 z* R5 o) O- }) C G1 L3 H% ]5.3.7 Fluoroplastics
" i* f; M1 ~* h& C" J6 N* ~5.3.7.1 Polytetrafluoroethylene4 T% `2 E3 Z1 h8 j$ B0 D
5.3.7.2 FEP! [) B) ?; q x/ b' z/ k
5.3.7.3 Other Fluoroplastics- H0 {0 i" ~) y
5.4 Electron Beam Processing of Elastomers3 x' S7 G& `* I: V B
5.4.1 Physical Properties of Radiation Cross-linked Elastomers
% N( \0 J4 n4 ?5.4.2 Effects of Radiation on Individual Elastomers- H3 |, }* ^' D, l# x, n
5.4.2.1 Natural Rubber and Synthetic Polyisoprene
% Y/ S1 ^ y4 b: d5.4.2.2 Polybutadiene and Its Copolymers
% v$ V+ f+ ]" E8 n+ z5.4.2.3 Polyisobutylene and Its Copolymers
5 C N; B0 ?9 C* C s) X5.4.2.4 Ethylene-Propylene Copolymers and Terpolymers. Y7 K/ K- l, \6 @
5.4.2.5 Polychloroprene* V2 e& t& ?) o3 {6 w& o2 _
5.4.2.6 Silicone Elastomers( \4 N$ M& p) C5 y
5.4.2.7 Fluorocarbon Elastomers1 n% Z- S; d7 f
5.4.2.8 Fluorosilicone Elastomers
/ W* N5 f5 ^9 y# ` U2 `+ K9 d5.5 Electron Beam Processing of Liquid Systems, [; \1 X4 P, g. D
5.6 Grafting and Other Polymer Modifications7 s7 i5 { v- A4 \+ h8 A/ [
5.6.1 Grafting7 I& `7 k6 \6 v4 ]: v% M8 O
5.6.2 Other Polymer Modifications5 j: w/ [, ?$ Z1 _! v6 N; @
References$ T/ s3 N6 n1 v9 V3 k, C
Chapter 6 Coating Methods Used in UV and EB Technology; C7 o! `: G K/ Z3 J
6.1 Roll Coating
& T" M( l. n6 W6.1.1 Direct Roll Coating4 j' u% w* F3 b
6.1.2 Reverse Roll Coating
# h/ H; ?3 _. f7 t& b' l( a+ V) B6.2 Curtain Coating
( {6 N5 A5 h, }2 y3 L$ F6.3 Spray Application& N( Q, |; Y2 H2 E; ?& X
6.3.1 Compressed Air Gun Spraying6 _& y5 X6 E1 F; y! a
6.3.2 Airless Gun Spraying) n, r9 P6 B2 L0 ?; j+ f
6.4 Dip Coating1 K' w' o. W" m* ?
6.5 Flow Coating C) z) [: r) }
6.6 Spin Coating3 E8 v, p0 ?$ x7 n* e3 W5 h# L
6.7 Rod Coating
- A& k. u1 i! j1 S7 ?* ^4 r' _References
9 ^0 I4 @0 X) f8 G. G4 yChapter 7 Applications of UV Radiation
) d3 m4 Y) Y, s& i) L P3 D$ X7.1 UV Curing of Coatings and Paints
& X9 s$ u$ I% r: q- G! x7.1.1 Functional and Decorative Coatings
r1 }3 ]9 v- ~; @; K" I7.1.1.1 Coatings on Flat, Rigid Substrates
# p2 E- A6 v3 Q7.1.1.2 UV Curing of Coatings on Flexible Substrates6 i% b8 h8 @, z0 O( C6 ?. t
7.1.2 UV Curing of Lacquers, Varnishes and Paints
* b) v# p& p, K$ G1 h" x% I7.1.3 Three-Dimensional Curing. d4 T; r5 C$ h. K
7.1.4 UV Curing of Coatings and Inks on Cylindrical Parts. R1 t8 H# |$ m7 U' u
7.1.5 UV Matting of Coatings# A+ C/ ]( ]" f: x7 K" ?* o& O4 G
7.2 UV Curing of Adhesives3 b0 X D% p+ s$ h+ `
7.3 UV-Cured Silicone Release Coatings
3 Y. D( W& J( G0 S3 z5 g7.4 Spot Curing
. ]- X# Y j0 v7.5 UV Curing in Printing and Graphic Arts7 J2 g7 z0 R, U# C# H8 [2 O
7.5.1 Screen Printing
( ~( g% x6 j3 i: c, p: {! o7.5.2 Flexography
; b, L# k% R' N- p C; ^; j/ y% O7.5.3 Letterpress and Offset Letterpress (Dry Offset)
! Q7 c5 A& [& G, t0 _7.5.4 Lithography5 U0 m) G. O; p) v4 V/ M
7.5.5 Rotogravure Printing
4 n6 U5 R. ]% p& \7 K7 i( m7.6 Rapid Prototyping7 W' m- |. i& N" Z
7.7 UV Powder Coatings
% t8 {, [: u* Y8 C3 E% f9 T6 F! D7.7.1 The Chemistry of UV-Curable Powders
K% T/ T& I# J* l, D7.7.2 Material and Substrate Preparation
8 x/ r. x5 K) ^/ F5 L4 M7.7.3 Powder Coating Application
0 g' ?7 c. P/ P3 D7.7.4 Substrates Suitable for UV Powder Coating
+ W* M9 Q( P+ U& X. ?: f( `& n7.7.4.1 Plastics& N4 M2 i. n- z7 H9 v: ^$ R' X
7.7.4.2 Wood and Wood Composites; p( z1 @8 F+ ?6 e/ G7 e$ ^* c8 j, c
7.7.4.3 Preassembled Parts
/ Z. L4 k% n5 ~7.7.4.4 Large-Mass Parts
& q/ p6 r; D& c8 H' d7.7.5 Applications
, N+ e- M/ J& [2 D7.8 Other Applications for UV Curing
1 W1 B4 P6 d" d; d7.8.1 Electronics
& F7 {! O4 E3 W9 v7.8.2 Optical Components and Optoelectronic Applications. o% o- \1 J) V- U, V7 Q E
7.8.2.1 Optical Fibers5 w6 |! n/ ]! z+ w$ |9 B" M7 Y
7.8.2.2 Other Optical and Optoelectronic Applications
& M4 n8 j6 @7 M6 \7.9 Production of Composites8 R6 v% ^# D c6 D3 j4 h. t- B# o
7.9.1 Dental Applications
4 `) \) t8 y! d( ~$ L3 {" |7.9.2 Other Composite Applications$ s" y7 R, K+ d' L
Chapter 8 Applications of Electron Beam Radiation3 j' Z/ {6 N( W/ b5 n
8.1 EB Processing in the Wire and Cable Technology/ d; Y6 x$ d1 j! q
8.1.1 Equipment and Process" E0 x* K+ l8 Y
8.1.2 Recent Developments and Trends
+ n' Y8 Q; @% A4 h' L+ z8.2 EB Processing in Tire Technology- r! F3 T5 _2 j6 `( x' q) }4 Y
8.3 EB Processing in the Manufacture of Polyolefin Foams
8 y& q+ }. D; z" O5 N! r8.3.1 Foam Expansion and Its Control( ^* A" L$ t' n3 ~" i
8.3.2 Manufacturing Processes
& \ i: c0 X0 |: K6 T8.3.3 Comparison of Chemical and Radiation Processes7 }) F: T ]) e& a
8.4 EB Processing in the Production of Heat-Shrinkable Materials( E! R& M% H/ y6 C; e% ~; a
8.4.1 Heat-Shrinkable Tubing" {. G' I, }4 N1 D
8.4.2 Heat-Shrinkable Sheets and Films) |, i- U1 C2 z, u2 g7 \
8.5 EB Processing in Coatings, Adhesives, Paints and Printing Inks
" _9 E: o- F' v# b8.5.1 Magnetic Media0 K }+ o \$ ?
8.5.2 Coatings. p% l7 c0 n4 |
8.5.3 Printing and Graphic Arts
. T+ u% L k7 _8 I8.5.4 Adhesives
5 a' p( u) k% o% r; R8.5.4.1 Pressure-Sensitive Adhesives (PSAs)8 t4 V I6 N* e9 v& [) ?
8.5.4.2 Laminating Adhesives
8 ?5 p/ [' I- b0 T! s6 F2 I8.5.5 Polymeric Fiber-Reinforced Composites! t5 s" d( _; `
References) Z+ G$ H9 x) j t
Chapter 9 Dosimetry and Radiometry
7 H6 L! z% T3 V2 B: a/ [" D4 [% h9.1 EB Dosimetry9 q% U9 n$ w9 C( z* k1 [
9.2 UV Radiometry/ v+ W, p' i' Y7 b* [
9.2.1 Actinometers3 D3 C8 m4 b; @! X
9.2.2 Radiometers$ P" P/ c- q: I2 u) Y
9.2.3 Radiachromic Films O9 G {5 Y" Y( O
References
; e' h) m' R" e% M4 ]& H' F- U3 o0 g XChapter 10 Safety and Hygiene$ f% L2 D/ I5 L
10.1 UV Equipment Health and Safety
; U) Y1 d3 ~) F/ F2 Y0 g# X# M; ], e: u, o10.2 EB Equipment Health and Safety
3 ?* o* E+ a% E10.3 Chemical Hazards7 h6 Q# z! Y: q
References
8 F/ O. D: K# oChapter 11 Recent Developments and Trends
7 h3 {: o8 i L- V11.1 Current Trends in Equipment and Chemistry* w1 C8 `4 f' `. h. R0 D( k: D
11.1.1 UV/EB Equipment$ p" x) h0 d5 N9 E- i+ M2 J; G
11.1.2 Chemistry- V g+ ?1 ?. }2 @0 r
11.2 Emerging Technologies ?1 A2 `" U0 W8 c( `4 _3 B
References* s' @! I, f: q0 k$ \( Z7 }
Appendix I
8 }2 B0 @- x% j& v( }1 }; HBibliography
: ^" m& n7 h9 F9 b. a9 }5 g% wAppendix II
! e0 @9 h. U& [6 x( LMajor Equipment Manufacturers/ ~4 [" r* r3 g
Glossary% D! u5 i: }8 J( P+ I; g6 @
: r" }, F, E# M' B* W[ 本帖最后由 benzone 于 2007-12-10 13:31 编辑 ] |
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